EP3SE260F1152C4N vs EP3SE260F1152I4N Perbandingan
Perbandingan bersamaan detil EP3SE260F1152C4N dari Intel dan EP3SE260F1152I4N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Intel
EP3SE260F1152I4N - Stratix III E FPGA, 255K LE, 1152-FCBGA | Intel
EP3SE260F1152I4N ⚠ Waktu Beli TerakhirPerbandingan Spesifikasi
| Parameter Umum | EP3SE260F1152C4N | EP3SE260F1152I4N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Waktu Pembelian Terakhir |
| Series | Stratix III E | Stratix III E |
| Family | Stratix III (Enhanced) | — |
| Logic Elements (LEs) | 255,000 | — |
| Embedded Memory | 16,672,768 bits (16.67 Mbit) | — |
| Maximum User I/Os | 744 | — |
| Number of LABs/CLBs | 10,200 | — |
| DSP / 18x18 Multipliers | 768 embedded multipliers | — |
| Process Technology | 65 nm CMOS | TSMC 40 nm |
| Core Voltage | 1.1 V | 0.86 V |
| Maximum Operating Frequency | 450 MHz | — |
| Paket | 1152-ball FC-FBGA (flip-chip) | 1152-ball FCBGA (35 mm x 35 mm) |
| Speed Grade | -4 (commercial temperature) | 4 |
| Suhu Kerja | 0C to +85C (commercial, 'C' suffix) | -40C to +100C (Industrial) |
| Tipe Mounting | Surface Mount (BGA) | Surface Mount |
| Packaging | Tray | — |
| Lead-Free / RoHS | Lead-free finish (RoHS compliant per distributor listing) | — |
| Tipe Memori | SRAM-based, volatile (requires configuration device) | — |
| Configuration | External EPCS / enhanced configuration via AS, PS, JTAG, or FPP | — |
| Product Status | Obsolete (per Xecor cross-reference data) | — |
| Logic Elements | — | 255,000 |
| Embedded Memory (bits) | — | 16,672,768 |
| Logic Array Blocks (LABs) | — | 10,200 |
| Maximum User I/O | — | 744 |
| DSP Blocks (18x18 multipliers) | — | 896 |
| Transceivers | — | 48 (up to 8.5 Gbps) |
| Level MSL | — | 3 (168 hours) |
| Status RoHS | — | Compliant |