EP3SE260F1152I3G vs EP3SE260F1152C4N 比較

詳細並排比較 EP3SE260F1152I3G 由 Intel 與 EP3SE260F1152C4N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

規格比較

參數 EP3SE260F1152I3G EP3SE260F1152C4N
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 NRND Obsolete
Series Stratix III E Stratix III E
Family Stratix III Stratix III (Enhanced)
Logic Elements (LE) 255,000 —
Embedded Memory Bits 16,672,640 bits —
Embedded Memory Bits (alternate) 20,880 Kb (16,672,640 / 1024) —
User I/O Count 744 —
封裝 1152-BBGA, FCBGA (FineLine BGA) 1152-ball FC-FBGA (flip-chip)
工作溫度範圍 -40C to +100C (Industrial) —
Speed Grade I3 (Industrial, balanced) -4 (commercial temperature)
Process Technology 40 nm TSMC low-power 65 nm CMOS
Supply Voltage Core 0.9 V (typical, see handbook) —
Configuration Bitstream Encryption AES-256 (Stratix III feature) —
I/O Standards Supported LVDS, LVPECL, HSTL, SSTL, LVCMOS, PCI, PCI-X —
安裝類型 Surface Mount (BGA) Surface Mount (BGA)
RoHS 狀態 [DATA_NEEDED: RoHS compliance not stated in scraped data] —
濕度敏感等級 (MSL) [DATA_NEEDED: MSL rating per JEDEC J-STD-020] —
Lead-Free Reflow [DATA_NEEDED: peak reflow temperature] —
Design Toolchain Quartus II / Quartus Prime —
Country of Origin / Distribution Multiple authorized distributors (DigiKey, Mouser) —
Logic Elements (LEs) — 255,000
Embedded Memory — 16,672,768 bits (16.67 Mbit)
Maximum User I/Os — 744
Number of LABs/CLBs — 10,200
DSP / 18x18 Multipliers — 768 embedded multipliers
Core Voltage — 1.1 V
Maximum Operating Frequency — 450 MHz
工作溫度 — 0C to +85C (commercial, 'C' suffix)
Packaging — Tray
Lead-Free / RoHS — Lead-free finish (RoHS compliant per distributor listing)
記憶體類型 — SRAM-based, volatile (requires configuration device)
Configuration — External EPCS / enhanced configuration via AS, PS, JTAG, or FPP
Product Status — Obsolete (per Xecor cross-reference data)

資料表與資源

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