EP3SE260F1152I3G vs EP3SE260F1152C4N तुलना
विस्तृत दोनों ओर की तुलना EP3SE260F1152I3G द्वारा Intel और EP3SE260F1152C4N द्वारा Intel. मुख्य विशेषताओं, इलेक्ट्रिकल पैरामीटर, पैकेजिंग, चक्र स्थिति, मूल्यांकन और उपलब्धता को तुलना करके अपनी डिजाइन की आवश्यकताओं के लिए सबसे अच्छा घटक निर्धारित करें。
विशेषता तुलना
| पैरामीटर | EP3SE260F1152I3G | EP3SE260F1152C4N |
|---|---|---|
| ब्रांड | Intel | Intel |
| श्रेणी | FPGA & CPLD | FPGA & CPLD |
| लाइफसाइकिल स्थिति | NRND | Obsolete |
| Series | Stratix III E | Stratix III E |
| Family | Stratix III | Stratix III (Enhanced) |
| Logic Elements (LE) | 255,000 | — |
| Embedded Memory Bits | 16,672,640 bits | — |
| Embedded Memory Bits (alternate) | 20,880 Kb (16,672,640 / 1024) | — |
| User I/O Count | 744 | — |
| पैकेज | 1152-BBGA, FCBGA (FineLine BGA) | 1152-ball FC-FBGA (flip-chip) |
| ऑपरेटिंग तापमान रेंज | -40C to +100C (Industrial) | — |
| Speed Grade | I3 (Industrial, balanced) | -4 (commercial temperature) |
| Process Technology | 40 nm TSMC low-power | 65 nm CMOS |
| Supply Voltage Core | 0.9 V (typical, see handbook) | — |
| Configuration Bitstream Encryption | AES-256 (Stratix III feature) | — |
| I/O Standards Supported | LVDS, LVPECL, HSTL, SSTL, LVCMOS, PCI, PCI-X | — |
| माउंटिंग प्रकार | Surface Mount (BGA) | Surface Mount (BGA) |
| RoHS स्थिति | [DATA_NEEDED: RoHS compliance not stated in scraped data] | — |
| नमी संवेदनशीलता स्तर (MSL) | [DATA_NEEDED: MSL rating per JEDEC J-STD-020] | — |
| Lead-Free Reflow | [DATA_NEEDED: peak reflow temperature] | — |
| Design Toolchain | Quartus II / Quartus Prime | — |
| Country of Origin / Distribution | Multiple authorized distributors (DigiKey, Mouser) | — |
| Logic Elements (LEs) | — | 255,000 |
| Embedded Memory | — | 16,672,768 bits (16.67 Mbit) |
| Maximum User I/Os | — | 744 |
| Number of LABs/CLBs | — | 10,200 |
| DSP / 18x18 Multipliers | — | 768 embedded multipliers |
| Core Voltage | — | 1.1 V |
| Maximum Operating Frequency | — | 450 MHz |
| ऑपरेटिंग तापमान | — | 0C to +85C (commercial, 'C' suffix) |
| Packaging | — | Tray |
| Lead-Free / RoHS | — | Lead-free finish (RoHS compliant per distributor listing) |
| मेमोरी प्रकार | — | SRAM-based, volatile (requires configuration device) |
| Configuration | — | External EPCS / enhanced configuration via AS, PS, JTAG, or FPP |
| Product Status | — | Obsolete (per Xecor cross-reference data) |