EP3SE260F1152I3G vs EP3SE260F1152C4N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260F1152I3G sa pamamagitan ng Intel at EP3SE260F1152C4N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SE260F1152I3G EP3SE260F1152C4N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND Obsolete
Series Stratix III E Stratix III E
Family Stratix III Stratix III (Enhanced)
Logic Elements (LE) 255,000 —
Embedded Memory Bits 16,672,640 bits —
Embedded Memory Bits (alternate) 20,880 Kb (16,672,640 / 1024) —
User I/O Count 744 —
Packhaging 1152-BBGA, FCBGA (FineLine BGA) 1152-ball FC-FBGA (flip-chip)
Hanay ng Temperature na Operasyon -40C to +100C (Industrial) —
Speed Grade I3 (Industrial, balanced) -4 (commercial temperature)
Process Technology 40 nm TSMC low-power 65 nm CMOS
Supply Voltage Core 0.9 V (typical, see handbook) —
Configuration Bitstream Encryption AES-256 (Stratix III feature) —
I/O Standards Supported LVDS, LVPECL, HSTL, SSTL, LVCMOS, PCI, PCI-X —
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount (BGA)
Tindminan RoHS [DATA_NEEDED: RoHS compliance not stated in scraped data] —
Level ng Sensitivity sa Asid ng Moisture (MSL) [DATA_NEEDED: MSL rating per JEDEC J-STD-020] —
Lead-Free Reflow [DATA_NEEDED: peak reflow temperature] —
Design Toolchain Quartus II / Quartus Prime —
Country of Origin / Distribution Multiple authorized distributors (DigiKey, Mouser) —
Logic Elements (LEs) — 255,000
Embedded Memory — 16,672,768 bits (16.67 Mbit)
Maximum User I/Os — 744
Number of LABs/CLBs — 10,200
DSP / 18x18 Multipliers — 768 embedded multipliers
Core Voltage — 1.1 V
Maximum Operating Frequency — 450 MHz
Temperature na Operasyon — 0C to +85C (commercial, 'C' suffix)
Packaging — Tray
Lead-Free / RoHS — Lead-free finish (RoHS compliant per distributor listing)
Uri ng Memory — SRAM-based, volatile (requires configuration device)
Configuration — External EPCS / enhanced configuration via AS, PS, JTAG, or FPP
Product Status — Obsolete (per Xecor cross-reference data)

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