EP3SE260F1517I4LN vs EP3SL200F1517I4LN Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SE260F1517I4LN disebabkan oleh Intel dan EP3SL200F1517I4LN disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP3SE260F1517I4LN - 260K LE Stratix III E FPGA, 1517-FCBGA | Intel
EP3SE260F1517I4LN ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP3SE260F1517I4LN | EP3SL200F1517I4LN |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | NRND |
| Logic Elements | 255,000 | 200,000 |
| Embedded Memory Bits | 16,672,768 bits (~2,044 KBytes) | 10,901,504 |
| Logic Array Blocks (LABs) | 10,200 | 8,000 |
| User I/O Count | 976 | — |
| Kemasan | 1517-ball FCBGA (40 mm x 40 mm, 1.0 mm pitch) | 1517-BBGA, FCBGA |
| Process Technology | 40 nm CMOS | 65 nm TSMC low-power |
| Family | Stratix III E (Enhanced) | Stratix III L |
| Speed Grade | I4 (industrial, 4th tier) | — |
| Power Option | L (low-power) | — |
| Suhu Operasi | -40C to +100C (case, industrial) | -40C to +100C (Industrial) |
| Lead-Free / RoHS | Yes (N suffix) | — |
| Transceivers | Stratix III E family supports up to 24 transceivers up to 8.5 Gbps | — |
| DSP Blocks (18x18 multipliers) | Up to 384 (family-level, device-specific count not in provided data) | 384 |
| Partial Reconfiguration | Supported | — |
| Memory Interface Support | DDR3, DDR2, QDR II+ (hardened PHY) | — |
| Configuration Scheme | Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP), JTAG | — |
| User I/O Pins | — | 976 |
| Jenis Pemasangan | — | Surface Mount (BGA) |
| Status RoHS | — | Compliant |
| Lead-Free | — | Yes |
| Aras MSL | — | [DATA_NEEDED: MSL moisture sensitivity level] |
| Supply Voltage Core | — | [DATA_NEEDED: VCC core voltage] |
| Transceiver Data Rate (max) | — | [DATA_NEEDED: max transceiver rate] |
| DSP Performance | — | 288 GMACS |
| Configuration Method | — | Passive Parallel / Active Serial / JTAG |
| Ball Pitch | — | 1.0 mm |
| Package Dimensions | — | 40 mm x 40 mm |