EP3SE260F1517I4LN vs EP3SL200F1517I4LN Perbandingan

Perbandingan bersamaan detil EP3SE260F1517I4LN dari Intel dan EP3SL200F1517I4LN dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Intel
EP3SE260F1517I4LN EP3SE260F1517I4LN - 260K LE Stratix III E FPGA, 1517-FCBGA | Intel

EP3SE260F1517I4LN - 260K LE Stratix III E FPGA, 1517-FCBGA | Intel

EP3SE260F1517I4LN ⚠ Waktu Beli Terakhir

Perbandingan Spesifikasi

Parameter Umum EP3SE260F1517I4LN EP3SL200F1517I4LN
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Waktu Pembelian Terakhir NRND
Logic Elements 255,000 200,000
Embedded Memory Bits 16,672,768 bits (~2,044 KBytes) 10,901,504
Logic Array Blocks (LABs) 10,200 8,000
User I/O Count 976 —
Paket 1517-ball FCBGA (40 mm x 40 mm, 1.0 mm pitch) 1517-BBGA, FCBGA
Process Technology 40 nm CMOS 65 nm TSMC low-power
Family Stratix III E (Enhanced) Stratix III L
Speed Grade I4 (industrial, 4th tier) —
Power Option L (low-power) —
Suhu Kerja -40C to +100C (case, industrial) -40C to +100C (Industrial)
Lead-Free / RoHS Yes (N suffix) —
Transceivers Stratix III E family supports up to 24 transceivers up to 8.5 Gbps —
DSP Blocks (18x18 multipliers) Up to 384 (family-level, device-specific count not in provided data) 384
Partial Reconfiguration Supported —
Memory Interface Support DDR3, DDR2, QDR II+ (hardened PHY) —
Configuration Scheme Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP), JTAG —
User I/O Pins — 976
Tipe Mounting — Surface Mount (BGA)
Status RoHS — Compliant
Lead-Free — Yes
Level MSL — [DATA_NEEDED: MSL moisture sensitivity level]
Supply Voltage Core — [DATA_NEEDED: VCC core voltage]
Transceiver Data Rate (max) — [DATA_NEEDED: max transceiver rate]
DSP Performance — 288 GMACS
Configuration Method — Passive Parallel / Active Serial / JTAG
Ball Pitch — 1.0 mm
Package Dimensions — 40 mm x 40 mm

Spek dan Sumber

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