EP3SE260F1517I4LN vs EP3SL200F1517I4LN Karşılaştırma
Ayrıntılı yan yana karşılaştırma EP3SE260F1517I4LN tarafından Intel ve EP3SL200F1517I4LN tarafından IntelAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
Intel
EP3SE260F1517I4LN - 260K LE Stratix III E FPGA, 1517-FCBGA | Intel
EP3SE260F1517I4LN ⚠ Son Satın AlmaÖzellik Karşılaştırması
| Parametre | EP3SE260F1517I4LN | EP3SL200F1517I4LN |
|---|---|---|
| Marka | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Yaşam Döngüsü Durumu | Son Alış Zamanı | NRND |
| Logic Elements | 255,000 | 200,000 |
| Embedded Memory Bits | 16,672,768 bits (~2,044 KBytes) | 10,901,504 |
| Logic Array Blocks (LABs) | 10,200 | 8,000 |
| User I/O Count | 976 | — |
| Paket | 1517-ball FCBGA (40 mm x 40 mm, 1.0 mm pitch) | 1517-BBGA, FCBGA |
| Process Technology | 40 nm CMOS | 65 nm TSMC low-power |
| Family | Stratix III E (Enhanced) | Stratix III L |
| Speed Grade | I4 (industrial, 4th tier) | — |
| Power Option | L (low-power) | — |
| İşletim Sıcaklığı | -40C to +100C (case, industrial) | -40C to +100C (Industrial) |
| Lead-Free / RoHS | Yes (N suffix) | — |
| Transceivers | Stratix III E family supports up to 24 transceivers up to 8.5 Gbps | — |
| DSP Blocks (18x18 multipliers) | Up to 384 (family-level, device-specific count not in provided data) | 384 |
| Partial Reconfiguration | Supported | — |
| Memory Interface Support | DDR3, DDR2, QDR II+ (hardened PHY) | — |
| Configuration Scheme | Active Serial (AS), Passive Serial (PS), Fast Passive Parallel (FPP), JTAG | — |
| User I/O Pins | — | 976 |
| Montaj Türü | — | Surface Mount (BGA) |
| RoHS Durumu | — | Compliant |
| Lead-Free | — | Yes |
| MSL Seviyesi | — | [DATA_NEEDED: MSL moisture sensitivity level] |
| Supply Voltage Core | — | [DATA_NEEDED: VCC core voltage] |
| Transceiver Data Rate (max) | — | [DATA_NEEDED: max transceiver rate] |
| DSP Performance | — | 288 GMACS |
| Configuration Method | — | Passive Parallel / Active Serial / JTAG |
| Ball Pitch | — | 1.0 mm |
| Package Dimensions | — | 40 mm x 40 mm |