EP3SE260H780C3 vs EP3SE50F780C3G Comparison

Detailed side-by-side comparison of EP3SE260H780C3 by Intel and EP3SE50F780C3G by Altera. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SE260H780C3 EP3SE50F780C3G
Brand Intel Altera
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $1,180.00 $1,030.00
Device Family Stratix III Enhanced (Stratix III E) β€”
Series EP3SE Stratix III E
Logic Elements 255,000 β€”
Logic Array Blocks (LABs) 10200 β€”
Embedded Memory 16,672,768 bits (16.67 Mbit) 5.49 Mbit (5,760,000 bit)
User I/Os 488 β€”
Operating Voltage (Core) 0.9 V β€”
Operating Voltage (Auxiliary) 1.1 V β€”
Process Technology 65 nm CMOS β€”
Speed Grade C3 C3
Operating Temperature Commercial, 0C to +85C 0C to +85C (Commercial)
Maximum Core Frequency 500 MHz β€”
Package 780-ball FCBGA (HBGA), flip-chip β€”
Mounting Type Surface Mount (BGA) β€”
Moisture Sensitivity Level (MSL) 3 (168 hours) β€”
Packaging Type Tray β€”
Configuration Memory Support Fast passive parallel, JTAG, Active Serial β€”
RoHS Status Compliant (per product listings) Compliant
Manufacturer β€” Altera (now Intel)
Family β€” Stratix III E enhanced FPGA
Number of Logic Elements (LE) β€” 47,500 LE
Number of Adaptive Logic Modules (ALM) β€” 19,000 ALM
Number of User I/O β€” 488
Number of I/O Banks β€” [DATA_NEEDED: I/O bank count]
Core Supply Voltage β€” 1.1 V
Package / Case β€” 780-BBGA, FCBGA (Flip-Chip)
Mounting Style β€” SMD/SMT
Packaging β€” Tray
Lifecycle Status β€” Not Recommended for New Designs (NRND)
Configuration Memory β€” External (EPCS / flash)

Datasheets & Resources

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