EP3SE260H780C3 vs EP3SE50F780C3G Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SE260H780C3 sa pamamagitan ng Intel at EP3SE50F780C3G sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SE260H780C3 EP3SE50F780C3G
Brand Intel Altera
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo NRND
Device Family Stratix III Enhanced (Stratix III E) —
Series EP3SE Stratix III E
Logic Elements 255,000 —
Logic Array Blocks (LABs) 10200 —
Embedded Memory 16,672,768 bits (16.67 Mbit) 5.49 Mbit (5,760,000 bit)
User I/Os 488 —
Operating Voltage (Core) 0.9 V —
Operating Voltage (Auxiliary) 1.1 V —
Process Technology 65 nm CMOS —
Speed Grade C3 C3
Temperature na Operasyon Commercial, 0C to +85C 0C to +85C (Commercial)
Maximum Core Frequency 500 MHz —
Packhaging 780-ball FCBGA (HBGA), flip-chip —
Uri ng Pagpapasok Surface Mount (BGA) —
Level ng Sensitivity sa Asid ng Moisture (MSL) 3 (168 hours) —
Packaging Type Tray —
Configuration Memory Support Fast passive parallel, JTAG, Active Serial —
Tindminan RoHS Compliant (per product listings) Compliant
Manufacturer — Altera (now Intel)
Family — Stratix III E enhanced FPGA
Number of Logic Elements (LE) — 47,500 LE
Number of Adaptive Logic Modules (ALM) — 19,000 ALM
Number of User I/O — 488
Number of I/O Banks — [DATA_NEEDED: I/O bank count]
Core Supply Voltage — 1.1 V
Packhaging / Kaso — 780-BBGA, FCBGA (Flip-Chip)
Style ng Pagpapasok — SMD/SMT
Packaging — Tray
Katayuan ng Lifecycle — Not Recommended for New Designs (NRND)
Configuration Memory — External (EPCS / flash)

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