EP3SL340F1760C4 vs EP3SL340F1760I3 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SL340F1760C4 disebabkan oleh Intel dan EP3SL340F1760I3 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP3SL340F1760C4 - Stratix III L FPGA 337.5K LE | Intel | 1760-BGA
EP3SL340F1760C4 ⚠ Bahagian terakhir untuk beliIntel
EP3SL340F1760I3 - Stratix III L FPGA, 337.5K LE, 1760-BGA | Intel
EP3SL340F1760I3 ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP3SL340F1760C4 | EP3SL340F1760I3 |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Masa Terakhir Dibeli | Masa Terakhir Dibeli |
| Series | Stratix III L | Stratix III L |
| Logic Elements | 337,500 | 337,500 LE |
| Embedded Memory Bits | 18,821,144 | 18,822,144 bit |
| User I/O Count | 1,120 | — |
| Kemasan | 1760-BBGA, FCBGA (Flip-Chip) | — |
| Process Node | 65 nm | — |
| Core Voltage | 1.1 V | 1.1 V |
| Maximum Core Frequency | 450 MHz | — |
| Speed Grade | C4 (commercial) | I3 (Industrial, mid-speed bin) |
| Suhu Operasi | 0C to +85C (commercial) | -40 °C to 100 °C (Industrial grade, I3 suffix) |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, HSTL, SSTL, PCI, PCI-X | — |
| Transceivers | [DATA_NEEDED: number of embedded transceiver channels] | [DATA_NEEDED: transceiver count and data rate for this F1760 variant] |
| DSP Blocks | [DATA_NEEDED: DSP block count] | [DATA_NEEDED: 18x18 multiplier count] |
| PLLs | [DATA_NEEDED: PLL count] | [DATA_NEEDED: PLL count] |
| Configuration Scheme | Passive serial, fast passive parallel, JTAG | — |
| Status RoHS | Compliant | Compliant (Pb-free BGA balls) |
| Lead-Free | Yes | — |
| Jenis Pemasangan | Surface Mount (BGA) | Surface Mount |
| LABs (Logic Array Blocks) | — | 13,500 |
| User I/Os | — | 1120 |
| Number of Pins / Balls | — | 1760 |
| Package Type | — | FC-FBGA (1760-ball, FineLine BGA) |
| Package Code | — | BGA1760, 42x42, 40 |
| Process Technology | — | 65 nm |
| Configuration Memory | — | SRAM-based, volatile (requires external configuration device) |
| Aras MSL | — | MSL3 (JEDEC J-STD-020, reflow 245 °C peak) |