EP3SL340F1760C4 vs EP3SL340F1760I3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL340F1760C4 sa pamamagitan ng Intel at EP3SL340F1760I3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP3SL340F1760C4 - Stratix III L FPGA 337.5K LE | Intel | 1760-BGA
EP3SL340F1760C4 ⚠ Huling PagbiliIntel
EP3SL340F1760I3 - Stratix III L FPGA, 337.5K LE, 1760-BGA | Intel
EP3SL340F1760I3 ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP3SL340F1760C4 | EP3SL340F1760I3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Huling Pagbili |
| Series | Stratix III L | Stratix III L |
| Logic Elements | 337,500 | 337,500 LE |
| Embedded Memory Bits | 18,821,144 | 18,822,144 bit |
| User I/O Count | 1,120 | — |
| Packhaging | 1760-BBGA, FCBGA (Flip-Chip) | — |
| Process Node | 65 nm | — |
| Core Voltage | 1.1 V | 1.1 V |
| Maximum Core Frequency | 450 MHz | — |
| Speed Grade | C4 (commercial) | I3 (Industrial, mid-speed bin) |
| Temperature na Operasyon | 0C to +85C (commercial) | -40 °C to 100 °C (Industrial grade, I3 suffix) |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, HSTL, SSTL, PCI, PCI-X | — |
| Transceivers | [DATA_NEEDED: number of embedded transceiver channels] | [DATA_NEEDED: transceiver count and data rate for this F1760 variant] |
| DSP Blocks | [DATA_NEEDED: DSP block count] | [DATA_NEEDED: 18x18 multiplier count] |
| PLLs | [DATA_NEEDED: PLL count] | [DATA_NEEDED: PLL count] |
| Configuration Scheme | Passive serial, fast passive parallel, JTAG | — |
| Tindminan RoHS | Compliant | Compliant (Pb-free BGA balls) |
| Lead-Free | Yes | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| LABs (Logic Array Blocks) | — | 13,500 |
| User I/Os | — | 1120 |
| Number of Pins / Balls | — | 1760 |
| Package Type | — | FC-FBGA (1760-ball, FineLine BGA) |
| Package Code | — | BGA1760, 42x42, 40 |
| Process Technology | — | 65 nm |
| Configuration Memory | — | SRAM-based, volatile (requires external configuration device) |
| Level ng MSL | — | MSL3 (JEDEC J-STD-020, reflow 245 °C peak) |