EP3SL50F780C3 vs EP3SL50F780C2 Comparison

Detailed side-by-side comparison of EP3SL50F780C3 by Intel and EP3SL50F780C2 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3SL50F780C3 EP3SL50F780C2
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Last_time_buy Active
Stock Status In Stock In Stock
Unit Price (USD) $540.00 $199.95
Family Stratix III L (low-power) Stratix III L
Series Stratix III β€”
Logic Elements 47,500 β€”
Logic Array Blocks (LABs) 1,900 1,900
Embedded Memory Bits 2,184,192 β€”
User I/Os 488 β€”
Package Type 780-BBGA, FCBGA (FineLine) β€”
Device Pin Count 780 β€”
Operating Temperature 0C to +85C (Commercial) 0Β°C to +85Β°C (commercial)
Speed Grade 3 β€”
Supply Voltage (Core) [DATA_NEEDED: VCCINT nominal value] β€”
PLLs 12 β€”
Global Clock Networks 24 β€”
Process Node 65 nm TSMC β€”
Configuration Method SRAM-based, supports Partial Reconfiguration β€”
RoHS Status Compliant Compliant
Lead-Free / Halogen-Free Lead-Free (per package marking); Halogen-Free status unknown β€”
Moisture Sensitivity Level (MSL) MSL3 (per JEDEC J-STD-020, typical for large FBGA) β€”
Logic Elements (LE) β€” 47,500
Embedded Memory (bits) β€” 2,184,192
Maximum User I/Os β€” 488
Core Voltage β€” 1.1 V
Process Technology β€” 65 nm
Package β€” 780-ball FCBGA (Flip-Chip BGA)
Maximum Core Frequency β€” 600 MHz
Configuration Interface β€” JTAG / passive serial / fast passive parallel
I/O Standards β€” LVDS, LVCMOS, SSTL, HSTL, DDR2/DDR3 memory interfaces
Embedded Memory Type β€” TriMatrix (MLAB, M9K, M144K blocks)
Mounting Type β€” Surface Mount (BGA)

Datasheets & Resources

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