EP3SL50F780C3 vs EP3SL50F780C2 比較
詳細並排比較 EP3SL50F780C3 由 Intel 與 EP3SL50F780C2 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
Intel
EP3SL50F780C3 - Stratix III L FPGA, 47.5K LE, 780-FBGA | Intel / Altera
EP3SL50F780C3 ⚠ 最後購買機會規格比較
| 參數 | EP3SL50F780C3 | EP3SL50F780C2 |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 最後購買 | 啟用中 |
| Family | Stratix III L (low-power) | Stratix III L |
| Series | Stratix III | — |
| Logic Elements | 47,500 | — |
| Logic Array Blocks (LABs) | 1,900 | 1,900 |
| Embedded Memory Bits | 2,184,192 | — |
| User I/Os | 488 | — |
| Package Type | 780-BBGA, FCBGA (FineLine) | — |
| Device Pin Count | 780 | — |
| 工作溫度 | 0C to +85C (Commercial) | 0°C to +85°C (commercial) |
| Speed Grade | 3 | — |
| Supply Voltage (Core) | [DATA_NEEDED: VCCINT nominal value] | — |
| PLLs | 12 | — |
| Global Clock Networks | 24 | — |
| Process Node | 65 nm TSMC | — |
| Configuration Method | SRAM-based, supports Partial Reconfiguration | — |
| RoHS 狀態 | Compliant | Compliant |
| Lead-Free / Halogen-Free | Lead-Free (per package marking); Halogen-Free status unknown | — |
| 濕度敏感等級 (MSL) | MSL3 (per JEDEC J-STD-020, typical for large FBGA) | — |
| Logic Elements (LE) | — | 47,500 |
| Embedded Memory (bits) | — | 2,184,192 |
| Maximum User I/Os | — | 488 |
| Core Voltage | — | 1.1 V |
| Process Technology | — | 65 nm |
| 封裝 | — | 780-ball FCBGA (Flip-Chip BGA) |
| Maximum Core Frequency | — | 600 MHz |
| Configuration Interface | — | JTAG / passive serial / fast passive parallel |
| I/O Standards | — | LVDS, LVCMOS, SSTL, HSTL, DDR2/DDR3 memory interfaces |
| Embedded Memory Type | — | TriMatrix (MLAB, M9K, M144K blocks) |
| 安裝類型 | — | Surface Mount (BGA) |