EP3SL50F780C3 vs EP3SL50F780C2 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EP3SL50F780C3 disebabkan oleh Intel dan EP3SL50F780C2 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EP3SL50F780C3 EP3SL50F780C3 - Stratix III L FPGA, 47.5K LE, 780-FBGA | Intel / Altera

EP3SL50F780C3 - Stratix III L FPGA, 47.5K LE, 780-FBGA | Intel / Altera

EP3SL50F780C3 ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr EP3SL50F780C3 EP3SL50F780C2
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Masa Terakhir Dibeli Aktif
Family Stratix III L (low-power) Stratix III L
Series Stratix III —
Logic Elements 47,500 —
Logic Array Blocks (LABs) 1,900 1,900
Embedded Memory Bits 2,184,192 —
User I/Os 488 —
Package Type 780-BBGA, FCBGA (FineLine) —
Device Pin Count 780 —
Suhu Operasi 0C to +85C (Commercial) 0°C to +85°C (commercial)
Speed Grade 3 —
Supply Voltage (Core) [DATA_NEEDED: VCCINT nominal value] —
PLLs 12 —
Global Clock Networks 24 —
Process Node 65 nm TSMC —
Configuration Method SRAM-based, supports Partial Reconfiguration —
Status RoHS Compliant Compliant
Lead-Free / Halogen-Free Lead-Free (per package marking); Halogen-Free status unknown —
Tingkat sensitiviti Air Nama (MSL) MSL3 (per JEDEC J-STD-020, typical for large FBGA) —
Logic Elements (LE) — 47,500
Embedded Memory (bits) — 2,184,192
Maximum User I/Os — 488
Core Voltage — 1.1 V
Process Technology — 65 nm
Kemasan — 780-ball FCBGA (Flip-Chip BGA)
Maximum Core Frequency — 600 MHz
Configuration Interface — JTAG / passive serial / fast passive parallel
I/O Standards — LVDS, LVCMOS, SSTL, HSTL, DDR2/DDR3 memory interfaces
Embedded Memory Type — TriMatrix (MLAB, M9K, M144K blocks)
Jenis Pemasangan — Surface Mount (BGA)

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