EP3SL50F780C3 vs EP3SL50F780C2 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP3SL50F780C3 sa pamamagitan ng Intel at EP3SL50F780C2 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP3SL50F780C3 EP3SL50F780C2
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Huling Pagbili Aktibo
Family Stratix III L (low-power) Stratix III L
Series Stratix III —
Logic Elements 47,500 —
Logic Array Blocks (LABs) 1,900 1,900
Embedded Memory Bits 2,184,192 —
User I/Os 488 —
Package Type 780-BBGA, FCBGA (FineLine) —
Device Pin Count 780 —
Temperature na Operasyon 0C to +85C (Commercial) 0°C to +85°C (commercial)
Speed Grade 3 —
Supply Voltage (Core) [DATA_NEEDED: VCCINT nominal value] —
PLLs 12 —
Global Clock Networks 24 —
Process Node 65 nm TSMC —
Configuration Method SRAM-based, supports Partial Reconfiguration —
Tindminan RoHS Compliant Compliant
Lead-Free / Halogen-Free Lead-Free (per package marking); Halogen-Free status unknown —
Level ng Sensitivity sa Asid ng Moisture (MSL) MSL3 (per JEDEC J-STD-020, typical for large FBGA) —
Logic Elements (LE) — 47,500
Embedded Memory (bits) — 2,184,192
Maximum User I/Os — 488
Core Voltage — 1.1 V
Process Technology — 65 nm
Packhaging — 780-ball FCBGA (Flip-Chip BGA)
Maximum Core Frequency — 600 MHz
Configuration Interface — JTAG / passive serial / fast passive parallel
I/O Standards — LVDS, LVCMOS, SSTL, HSTL, DDR2/DDR3 memory interfaces
Embedded Memory Type — TriMatrix (MLAB, M9K, M144K blocks)
Uri ng Pagpapasok — Surface Mount (BGA)

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