EP4CE55F23I8L vs EP4CE55F23C9L Comparison

Detailed side-by-side comparison of EP4CE55F23I8L by Intel and EP4CE55F23C9L by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP4CE55F23I8L EP4CE55F23C9L
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $143.43 $76.73
Device Family Cyclone IV E β€”
Logic Elements (LEs) 55,856 β€”
Embedded Memory Bits 2,396,160 bits (~234 Kbit / ~292.5 KByte) β€”
Maximum User I/O Pins 324 β€”
Embedded 18x18 Multipliers 156 156
General-Purpose PLLs 4 β€”
Process Technology 60 nm β€”
Core Supply Voltage 1.2 V β€”
Package 484-ball FBGA (23 x 23 mm, 1.0 mm pitch) 484-ball FBGA (F23)
Operating Temperature Range -40C to +100C (Industrial) β€”
Configuration Modes AS, PS, JTAG β€”
I/O Standards Supported LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI, PCI-X β€”
Speed Grade 8 C9 (fastest commercial/industrial)
RoHS Status Compliant Compliant
Lead-Free / Halogen-Free Yes / Yes β€”
Family β€” Cyclone IV E
Logic Elements (LE) β€” 55,856
Embedded Memory β€” 2,396,160 bits (2.5 Mbit)
PLLs β€” 4
User I/Os β€” 324
Operating Temperature β€” -40C to +85C (industrial)
Process Node β€” 60 nm low-power
Core Voltage β€” 1.2 V (typical)
Configuration Method β€” SRAM-based, requires external flash
Mounting Type β€” Surface Mount (BGA)
MSL Level β€” [DATA_NEEDED: MSL level]
Hard PCIe Blocks β€” 0 (soft PCIe via fabric)

Datasheets & Resources

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