EP4CE55F23I8L vs EP4CE55F23C9L Perbandingan
Perbandingan bersamaan detil EP4CE55F23I8L dari Intel dan EP4CE55F23C9L dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP4CE55F23I8L | EP4CE55F23C9L |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Device Family | Cyclone IV E | — |
| Logic Elements (LEs) | 55,856 | — |
| Embedded Memory Bits | 2,396,160 bits (~234 Kbit / ~292.5 KByte) | — |
| Maximum User I/O Pins | 324 | — |
| Embedded 18x18 Multipliers | 156 | 156 |
| General-Purpose PLLs | 4 | — |
| Process Technology | 60 nm | — |
| Core Supply Voltage | 1.2 V | — |
| Paket | 484-ball FBGA (23 x 23 mm, 1.0 mm pitch) | 484-ball FBGA (F23) |
| Rentang Suhu Kerja | -40C to +100C (Industrial) | — |
| Configuration Modes | AS, PS, JTAG | — |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI, PCI-X | — |
| Speed Grade | 8 | C9 (fastest commercial/industrial) |
| Status RoHS | Compliant | Compliant |
| Lead-Free / Halogen-Free | Yes / Yes | — |
| Family | — | Cyclone IV E |
| Logic Elements (LE) | — | 55,856 |
| Embedded Memory | — | 2,396,160 bits (2.5 Mbit) |
| PLLs | — | 4 |
| User I/Os | — | 324 |
| Suhu Kerja | — | -40C to +85C (industrial) |
| Process Node | — | 60 nm low-power |
| Core Voltage | — | 1.2 V (typical) |
| Configuration Method | — | SRAM-based, requires external flash |
| Tipe Mounting | — | Surface Mount (BGA) |
| Level MSL | — | [DATA_NEEDED: MSL level] |
| Hard PCIe Blocks | — | 0 (soft PCIe via fabric) |