EP4CE55F23I8L vs EP4CE55F23C9L Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CE55F23I8L sa pamamagitan ng Intel at EP4CE55F23C9L sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4CE55F23I8L | EP4CE55F23C9L |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Device Family | Cyclone IV E | — |
| Logic Elements (LEs) | 55,856 | — |
| Embedded Memory Bits | 2,396,160 bits (~234 Kbit / ~292.5 KByte) | — |
| Maximum User I/O Pins | 324 | — |
| Embedded 18x18 Multipliers | 156 | 156 |
| General-Purpose PLLs | 4 | — |
| Process Technology | 60 nm | — |
| Core Supply Voltage | 1.2 V | — |
| Packhaging | 484-ball FBGA (23 x 23 mm, 1.0 mm pitch) | 484-ball FBGA (F23) |
| Hanay ng Temperature na Operasyon | -40C to +100C (Industrial) | — |
| Configuration Modes | AS, PS, JTAG | — |
| I/O Standards Supported | LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI, PCI-X | — |
| Speed Grade | 8 | C9 (fastest commercial/industrial) |
| Tindminan RoHS | Compliant | Compliant |
| Lead-Free / Halogen-Free | Yes / Yes | — |
| Family | — | Cyclone IV E |
| Logic Elements (LE) | — | 55,856 |
| Embedded Memory | — | 2,396,160 bits (2.5 Mbit) |
| PLLs | — | 4 |
| User I/Os | — | 324 |
| Temperature na Operasyon | — | -40C to +85C (industrial) |
| Process Node | — | 60 nm low-power |
| Core Voltage | — | 1.2 V (typical) |
| Configuration Method | — | SRAM-based, requires external flash |
| Uri ng Pagpapasok | — | Surface Mount (BGA) |
| Level ng MSL | — | [DATA_NEEDED: MSL level] |
| Hard PCIe Blocks | — | 0 (soft PCIe via fabric) |