EP4CGX75DF27I7 vs EP4CGX110DF27I7N Comparison

Detailed side-by-side comparison of EP4CGX75DF27I7 by Intel and EP4CGX110DF27I7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP4CGX75DF27I7 EP4CGX110DF27I7N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $210.00 $198.00
Device Family Cyclone IV GX EP4CGX110
Logic Elements 73,920 LE β€”
Embedded Memory 4,257,792 bits (4.06 Mbit) β€”
Maximum User I/Os 310 β€”
Package 672-ball FBGA (F27) 672-ball FBGA, 1.0 mm pitch
Operating Supply Voltage (Core) 1.2 V β€”
Operating Temperature -40C to +85C (Industrial) -40C to +100C (Industrial)
Mounting Style SMD/SMT β€”
Packaging Tray β€”
Adaptive Logic Modules (ALMs) [DATA_NEEDED: ALM count for EP4CGX75] β€”
Transceivers [DATA_NEEDED: transceiver count and max data rate] 8 channels, up to 3.125 Gbps
DSP Blocks / 18x18 Multipliers [DATA_NEEDED: multiplier count] β€”
PLLs [DATA_NEEDED: PLL count] 4
Process Technology 60 nm low-power β€”
Configuration Modes JTAG, AS, PS, FPP β€”
RoHS Status Compliant Compliant
Series β€” Cyclone IV GX
Logic Elements (LEs) β€” 109,424
Logic Array Blocks (LABs) β€” 6,422
Embedded Memory (bits) β€” 5,621,760
Memory Blocks (M9K) β€” 610
Embedded 18x18 Multipliers β€” 280
User I/Os β€” 393
PCIe Hard IP Blocks β€” 4 (Gen1 x1/x2/x4)
Core Voltage β€” 1.2 V
Mounting Type β€” Surface Mount
Process Node β€” 60 nm
Configuration Scheme β€” AS, PS, JTAG, FPP

Datasheets & Resources

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