EP4CGX75DF27I7 vs EP4CGX110DF27I7N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP4CGX75DF27I7 sa pamamagitan ng Intel at EP4CGX110DF27I7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP4CGX75DF27I7 EP4CGX110DF27I7N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Device Family Cyclone IV GX EP4CGX110
Logic Elements 73,920 LE —
Embedded Memory 4,257,792 bits (4.06 Mbit) —
Maximum User I/Os 310 —
Packhaging 672-ball FBGA (F27) 672-ball FBGA, 1.0 mm pitch
Operating Supply Voltage (Core) 1.2 V —
Temperature na Operasyon -40C to +85C (Industrial) -40C to +100C (Industrial)
Style ng Pagpapasok SMD/SMT —
Packaging Tray —
Adaptive Logic Modules (ALMs) [DATA_NEEDED: ALM count for EP4CGX75] —
Transceivers [DATA_NEEDED: transceiver count and max data rate] 8 channels, up to 3.125 Gbps
DSP Blocks / 18x18 Multipliers [DATA_NEEDED: multiplier count] —
PLLs [DATA_NEEDED: PLL count] 4
Process Technology 60 nm low-power —
Configuration Modes JTAG, AS, PS, FPP —
Tindminan RoHS Compliant Compliant
Series — Cyclone IV GX
Logic Elements (LEs) — 109,424
Logic Array Blocks (LABs) — 6,422
Embedded Memory (bits) — 5,621,760
Memory Blocks (M9K) — 610
Embedded 18x18 Multipliers — 280
User I/Os — 393
PCIe Hard IP Blocks — 4 (Gen1 x1/x2/x4)
Core Voltage — 1.2 V
Uri ng Pagpapasok — Surface Mount
Process Node — 60 nm
Configuration Scheme — AS, PS, JTAG, FPP

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