EPF10K100EBC356-1X vs EPF10K100EBC356-2 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K100EBC356-1X sa pamamagitan ng Intel at EPF10K100EBC356-2 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EPF10K100EBC356-2 - 100K Gates FLEX 10KE FPGA 274 I/O BGA-356 | Intel
EPF10K100EBC356-2 ObsoletePagsanggunian na paghahambing
| Parametro | EPF10K100EBC356-1X | EPF10K100EBC356-2 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Obsolete |
| Series | FLEX 10KE | FLEX-10KE |
| Logic Elements | 4,992 | — |
| Typical Gates | 100,000 | 100,000 |
| Logic Array Blocks (LABs) | 624 | — |
| Embedded Array Blocks (EABs) | 12 | 12 |
| Total RAM Bits | 49,152 | 49,152 |
| User I/O Count | 274 | — |
| Propagation Delay | 0.6 ns | — |
| Logic Family | CMOS | — |
| Core Process Technology | 0.22 um CMOS, 5 metal layers | — |
| Core Supply Voltage | 2.5 V (2.375 V to 2.625 V) | — |
| I/O Supply Voltage | 3.3 V (multi-volt tolerant to 5 V) | — |
| Temperature na Operasyon | 0 C to +70 C (Commercial) | 0 C to 70 C (Commercial) |
| Package Type | 356-LBGA (BGA-356) | 356-LBGA (35 x 35 mm, 1.27 mm pitch) |
| Package Dimensions | 35 x 35 mm, 1.27 mm ball pitch | — |
| Speed Grade | -1X | -2 |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Configuration Method | Serial EPROM / Parallel EPROM / JTAG (IEEE 1149.1) | SRAM, JTAG (IEEE 1149.1) |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance] |
| Level ng MSL | [DATA_NEEDED: MSL rating] | — |
| Family | — | Embedded Programmable Logic Device (PLD) |
| Maximum System Gates | — | 158,000 |
| Logic Elements (LEs) | — | 4,992 |
| Number of LABs/CLBs | — | 624 |
| User I/O Pins | — | 274 |
| Supply Voltage (Core) | — | 2.375 V to 2.625 V (2.5 V nominal) |
| Propagation Delay (tPD) | — | 0.5 ns |
| Internal Operating Frequency | — | up to 250 MHz |
| Process Technology | — | CMOS, SRAM-based |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |