EPF10K100EBC356-1X vs EPF10K100EBC356-2 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EPF10K100EBC356-1X disebabkan oleh Intel dan EPF10K100EBC356-2 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EPF10K100EBC356-1X EPF10K100EBC356-2
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup NRND Obsolete
Series FLEX 10KE FLEX-10KE
Logic Elements 4,992 —
Typical Gates 100,000 100,000
Logic Array Blocks (LABs) 624 —
Embedded Array Blocks (EABs) 12 12
Total RAM Bits 49,152 49,152
User I/O Count 274 —
Propagation Delay 0.6 ns —
Logic Family CMOS —
Core Process Technology 0.22 um CMOS, 5 metal layers —
Core Supply Voltage 2.5 V (2.375 V to 2.625 V) —
I/O Supply Voltage 3.3 V (multi-volt tolerant to 5 V) —
Suhu Operasi 0 C to +70 C (Commercial) 0 C to 70 C (Commercial)
Package Type 356-LBGA (BGA-356) 356-LBGA (35 x 35 mm, 1.27 mm pitch)
Package Dimensions 35 x 35 mm, 1.27 mm ball pitch —
Speed Grade -1X -2
Jenis Pemasangan Surface Mount (BGA) Surface Mount
Configuration Method Serial EPROM / Parallel EPROM / JTAG (IEEE 1149.1) SRAM, JTAG (IEEE 1149.1)
Status RoHS [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS compliance]
Aras MSL [DATA_NEEDED: MSL rating] —
Family — Embedded Programmable Logic Device (PLD)
Maximum System Gates — 158,000
Logic Elements (LEs) — 4,992
Number of LABs/CLBs — 624
User I/O Pins — 274
Supply Voltage (Core) — 2.375 V to 2.625 V (2.5 V nominal)
Propagation Delay (tPD) — 0.5 ns
Internal Operating Frequency — up to 250 MHz
Process Technology — CMOS, SRAM-based
Lead-Free — [DATA_NEEDED: lead-free status]

Laporan Datasheet & Sumber

Lihat Semua Produk Buat BOQ Minta Bao Harga