EPF10K200EBC600-1 vs EPF10K200EBC600-2 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K200EBC600-1 sa pamamagitan ng Intel at EPF10K200EBC600-2 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EPF10K200EBC600-1 - 9984-Cell, 2.5V FPGA | Intel | Embedded Systems
EPF10K200EBC600-1 ObsoletePagsanggunian na paghahambing
| Parametro | EPF10K200EBC600-1 | EPF10K200EBC600-2 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Product Type | Field Programmable Gate Array (FPGA) | — |
| Device Family | FLEX-10KE | — |
| Logic Elements | 9,984 | — |
| Embedded Memory | 98,304 bits | — |
| Logic Array Blocks | 1,248 LABs | — |
| I/O Count | 470 I/O | — |
| Volte ng Pagbibigay | 2.5 V | 2.3 V to 2.7 V (core), 2.5/3.3 V (I/O) |
| Packhaging | 600-BGA | — |
| Technology | Mixed CMOS | — |
| Commercial Temperature | 85 C | — |
| Propagation Delay | 0.4 ns | 0.4 ns |
| Embedded Array | Enhanced embedded array | — |
| Memory Feature | Dual-port memory | — |
| Tindminan RoHS | unknown | unknown |
| Configuration Interface | [DATA_NEEDED: configuration interface] | — |
| Package Dimensions | [DATA_NEEDED: package dimensions] | 45 × 45 mm |
| Operating Current | [DATA_NEEDED: operating current] | — |
| Pinout | [DATA_NEEDED: 600-BGA ball map] | — |
| Moisture Sensitivity Level | [DATA_NEEDED: MSL level] | — |
| Series | — | FLEX-10KE |
| Logic Family | — | CMOS (SRAM-based) |
| Process Technology | — | 0.30 µm CMOS |
| Typical Gate Count | — | 200,000 gates |
| Logic Elements (LEs) | — | 9984 |
| Logic Array Blocks (LABs) | — | 1248 |
| Embedded Memory (EAB) | — | 98304 bits (96 Kbits) |
| Maximum User I/O | — | 470 pins |
| I/O Standards | — | LVTTL, LVCMOS, PCI, GTL+ |
| Package Type | — | 600-ball BGA (BGA-600) |
| Ball Pitch | — | 1.27 mm |
| Package Height | — | 1.1 mm max |
| Temperature na Operasyon | — | 0°C to +70°C (Commercial) |
| Uri ng Pagpapasok | — | Surface Mount |
| Configuration Method | — | JTAG (IEEE 1149.1), EPC2 serial PROM |
| Part Status | — | Obsolete |