EPF10K200EBC600-2 vs EPF10K200EBI600-2 Comparison
Detailed side-by-side comparison of EPF10K200EBC600-2 by Intel and EPF10K200EBI600-2 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EPF10K200EBI600-2 - FLEX 10KE FPGA 200K Gates 9984 LEs BGA-600 | Intel
EPF10K200EBI600-2 ObsoleteSpecification Comparison
| Parameter | EPF10K200EBC600-2 | EPF10K200EBI600-2 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $198.00 | $198.00 |
| Series | FLEX-10KE | β |
| Logic Family | CMOS (SRAM-based) | CMOS, SRAM-based |
| Process Technology | 0.30 Β΅m CMOS | β |
| Typical Gate Count | 200,000 gates | β |
| Logic Elements (LEs) | 9984 | 9,984 |
| Logic Array Blocks (LABs) | 1248 | 1,248 |
| Embedded Memory (EAB) | 98304 bits (96 Kbits) | β |
| Maximum User I/O | 470 pins | β |
| Propagation Delay | 0.4 ns | 0.4 ns (per -2 speed grade) |
| Supply Voltage | 2.3 V to 2.7 V (core), 2.5/3.3 V (I/O) | β |
| I/O Standards | LVTTL, LVCMOS, PCI, GTL+ | β |
| Package Type | 600-ball BGA (BGA-600) | β |
| Package Dimensions | 45 Γ 45 mm | β |
| Ball Pitch | 1.27 mm | β |
| Package Height | 1.1 mm max | β |
| Operating Temperature | 0Β°C to +70Β°C (Commercial) | 0 C to 70 C (commercial) |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| Configuration Method | JTAG (IEEE 1149.1), EPC2 serial PROM | JTAG / ByteBlaster (SRAM configuration) |
| Part Status | Obsolete | β |
| RoHS Status | unknown | Compliant (lead-free package) |
| Family | β | FLEX 10KE |
| System Gates | β | 200,000 |
| Embedded RAM | β | 98,304 bits |
| Embedded Array Blocks (EABs) | β | 12 (typical for this density) |
| User I/O Pins | β | 470 |
| Supply Voltage (VCCINT) | β | 2.5 V |
| Package | β | BGA-600, 45 x 45 mm, 1.27 mm pitch |