EPF10K200EBC600-2 vs EPF10K200EBI600-2 比較
詳細並排比較 EPF10K200EBC600-2 由 Intel 與 EPF10K200EBI600-2 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
Intel
EPF10K200EBI600-2 - FLEX 10KE FPGA 200K Gates 9984 LEs BGA-600 | Intel
EPF10K200EBI600-2 Obsolete規格比較
| 參數 | EPF10K200EBC600-2 | EPF10K200EBI600-2 |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | Obsolete | Obsolete |
| Series | FLEX-10KE | — |
| Logic Family | CMOS (SRAM-based) | CMOS, SRAM-based |
| Process Technology | 0.30 µm CMOS | — |
| Typical Gate Count | 200,000 gates | — |
| Logic Elements (LEs) | 9984 | 9,984 |
| Logic Array Blocks (LABs) | 1248 | 1,248 |
| Embedded Memory (EAB) | 98304 bits (96 Kbits) | — |
| Maximum User I/O | 470 pins | — |
| Propagation Delay | 0.4 ns | 0.4 ns (per -2 speed grade) |
| 供應電壓 | 2.3 V to 2.7 V (core), 2.5/3.3 V (I/O) | — |
| I/O Standards | LVTTL, LVCMOS, PCI, GTL+ | — |
| Package Type | 600-ball BGA (BGA-600) | — |
| Package Dimensions | 45 × 45 mm | — |
| Ball Pitch | 1.27 mm | — |
| Package Height | 1.1 mm max | — |
| 工作溫度 | 0°C to +70°C (Commercial) | 0 C to 70 C (commercial) |
| 安裝類型 | Surface Mount | Surface Mount (BGA) |
| Configuration Method | JTAG (IEEE 1149.1), EPC2 serial PROM | JTAG / ByteBlaster (SRAM configuration) |
| Part Status | Obsolete | — |
| RoHS 狀態 | unknown | Compliant (lead-free package) |
| Family | — | FLEX 10KE |
| System Gates | — | 200,000 |
| Embedded RAM | — | 98,304 bits |
| Embedded Array Blocks (EABs) | — | 12 (typical for this density) |
| User I/O Pins | — | 470 |
| Supply Voltage (VCCINT) | — | 2.5 V |
| 封裝 | — | BGA-600, 45 x 45 mm, 1.27 mm pitch |