EPF10K200EBC600-2 vs EPF10K200EBI600-2 Сравнение
Подробное сравнение бок о бок EPF10K200EBC600-2 от Intel и EPF10K200EBI600-2 от Intel. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
Intel
EPF10K200EBI600-2 - FLEX 10KE FPGA 200K Gates 9984 LEs BGA-600 | Intel
EPF10K200EBI600-2 ObsoleteСравнение характеристик
| Параметр | EPF10K200EBC600-2 | EPF10K200EBI600-2 |
|---|---|---|
| Бренд | Intel | Intel |
| Категория | FPGA & CPLD | FPGA & CPLD |
| Статус жизненного цикла | Obsolete | Obsolete |
| Наличие | In Stock | In Stock |
| Цена за единицу (USD) | $198,00 | $198,00 |
| Series | FLEX-10KE | — |
| Logic Family | CMOS (SRAM-based) | CMOS, SRAM-based |
| Process Technology | 0.30 µm CMOS | — |
| Typical Gate Count | 200,000 gates | — |
| Logic Elements (LEs) | 9984 | 9,984 |
| Logic Array Blocks (LABs) | 1248 | 1,248 |
| Embedded Memory (EAB) | 98304 bits (96 Kbits) | — |
| Maximum User I/O | 470 pins | — |
| Propagation Delay | 0.4 ns | 0.4 ns (per -2 speed grade) |
| Напряжение питания | 2.3 V to 2.7 V (core), 2.5/3.3 V (I/O) | — |
| I/O Standards | LVTTL, LVCMOS, PCI, GTL+ | — |
| Package Type | 600-ball BGA (BGA-600) | — |
| Package Dimensions | 45 × 45 mm | — |
| Ball Pitch | 1.27 mm | — |
| Package Height | 1.1 mm max | — |
| Рабочая температура | 0°C to +70°C (Commercial) | 0 C to 70 C (commercial) |
| Тип монтажа | Surface Mount | Surface Mount (BGA) |
| Configuration Method | JTAG (IEEE 1149.1), EPC2 serial PROM | JTAG / ByteBlaster (SRAM configuration) |
| Part Status | Obsolete | — |
| Статус RoHS | unknown | Compliant (lead-free package) |
| Family | — | FLEX 10KE |
| System Gates | — | 200,000 |
| Embedded RAM | — | 98,304 bits |
| Embedded Array Blocks (EABs) | — | 12 (typical for this density) |
| User I/O Pins | — | 470 |
| Supply Voltage (VCCINT) | — | 2.5 V |
| Корпус | — | BGA-600, 45 x 45 mm, 1.27 mm pitch |