EPF10K200EBC600-2 vs EPF10K200EBI600-2 비교
다음의 상세 나란히 비교: EPF10K200EBC600-2 제조: Intel 및 EPF10K200EBI600-2 제조: Intel. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.
Intel
EPF10K200EBI600-2 - FLEX 10KE FPGA 200K Gates 9984 LEs BGA-600 | Intel
EPF10K200EBI600-2 Obsolete사양 비교
| 파라미터 | EPF10K200EBC600-2 | EPF10K200EBI600-2 |
|---|---|---|
| 브랜드 | Intel | Intel |
| 카테고리 | FPGA & CPLD | FPGA & CPLD |
| 수명 주기 상태 | Obsolete | Obsolete |
| 재고 상태 | In Stock | In Stock |
| 단가 (USD) | $198.00 | $198.00 |
| Series | FLEX-10KE | — |
| Logic Family | CMOS (SRAM-based) | CMOS, SRAM-based |
| Process Technology | 0.30 µm CMOS | — |
| Typical Gate Count | 200,000 gates | — |
| Logic Elements (LEs) | 9984 | 9,984 |
| Logic Array Blocks (LABs) | 1248 | 1,248 |
| Embedded Memory (EAB) | 98304 bits (96 Kbits) | — |
| Maximum User I/O | 470 pins | — |
| Propagation Delay | 0.4 ns | 0.4 ns (per -2 speed grade) |
| 공급 전압 | 2.3 V to 2.7 V (core), 2.5/3.3 V (I/O) | — |
| I/O Standards | LVTTL, LVCMOS, PCI, GTL+ | — |
| Package Type | 600-ball BGA (BGA-600) | — |
| Package Dimensions | 45 × 45 mm | — |
| Ball Pitch | 1.27 mm | — |
| Package Height | 1.1 mm max | — |
| 동작 온도 | 0°C to +70°C (Commercial) | 0 C to 70 C (commercial) |
| 실장 유형 | Surface Mount | Surface Mount (BGA) |
| Configuration Method | JTAG (IEEE 1149.1), EPC2 serial PROM | JTAG / ByteBlaster (SRAM configuration) |
| Part Status | Obsolete | — |
| RoHS 상태 | unknown | Compliant (lead-free package) |
| Family | — | FLEX 10KE |
| System Gates | — | 200,000 |
| Embedded RAM | — | 98,304 bits |
| Embedded Array Blocks (EABs) | — | 12 (typical for this density) |
| User I/O Pins | — | 470 |
| Supply Voltage (VCCINT) | — | 2.5 V |
| 패키지 | — | BGA-600, 45 x 45 mm, 1.27 mm pitch |