EPF10K200EFC672-3 vs EPF10K250EFI672-3 Comparison

Detailed side-by-side comparison of EPF10K200EFC672-3 by Intel and EPF10K250EFI672-3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K200EFC672-3 EPF10K250EFI672-3
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $115.00 $125.00
Series FLEX 10KE β€”
Number of Logic Elements / Cells 9,984 β€”
Number of LABs / CLBs 1248 β€”
Total RAM Bits 98,304 bits (12 EABs of 8 Kbits) β€”
Number of I/O 470 β€”
Number of Gates (typical) 200,000 β€”
Supply Voltage - Operating 2.3 V to 2.7 V (2.5 V nominal) β€”
Process Technology 0.22 Β΅m CMOS CMOS, SRAM-based configuration
Maximum Operating Frequency 166.67 MHz β€”
Propagation Delay 0.4 ns β€”
Package / Case 672-BBGA (27 x 27 mm, 1.0 mm pitch, FineLine BGA) β€”
Mounting Type Surface Mount β€”
Operating Temperature 0 Β°C to +70 Β°C (commercial) 0 Β°C to 70 Β°C (commercial)
Configuration Memory SRAM-based (volatile, requires external configuration device) β€”
Number of PLLs 4 β€”
RoHS Status [DATA_NEEDED: rohs status] Unknown (legacy Altera non-RoHS device)
MSL Level [DATA_NEEDED: MSL level] β€”
Lead-Free [DATA_NEEDED: lead-free status] β€”
Family β€” FLEX 10KE
Typical Gates β€” 250,000
Logic Elements β€” [DATA_NEEDED: exact LE count]
User I/O Pins β€” 470
Embedded Array Blocks (EABs) β€” 12
EAB Dual-Port Width β€” Up to 16-bit
Maximum EAB Memory β€” [DATA_NEEDED: bits per EAB]
Propagation Delay (tpd) β€” 0.4 ns (typical, -3 speed grade)
Core Supply Voltage β€” 2.5 V
I/O Supply Voltage β€” 2.5 V / 3.3 V (multiVolt I/O)
Package β€” 672-ball FineLine BGA, 1.27 mm pitch
Configuration Interface β€” JTAG / ByteBlaster (EPC2/EPC8 PROM)
Design Entry β€” EDIF 2 0 0 / 3 0 0, LPM, VHDL, Verilog

Datasheets & Resources

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