EPF10K200EFC672-3 vs EPF10K250EFI672-3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K200EFC672-3 sa pamamagitan ng Intel at EPF10K250EFI672-3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EPF10K200EFC672-3 - FLEX 10KE FPGA 9984 Cells 470 I/O BGA-672 | Intel
EPF10K200EFC672-3 Obsolete
Pagsanggunian na paghahambing
| Parametro | EPF10K200EFC672-3 | EPF10K250EFI672-3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | NRND |
| Series | FLEX 10KE | — |
| Number of Logic Elements / Cells | 9,984 | — |
| Number of LABs / CLBs | 1248 | — |
| Total RAM Bits | 98,304 bits (12 EABs of 8 Kbits) | — |
| Number of I/O | 470 | — |
| Number of Gates (typical) | 200,000 | — |
| Supply Voltage - Operating | 2.3 V to 2.7 V (2.5 V nominal) | — |
| Process Technology | 0.22 µm CMOS | CMOS, SRAM-based configuration |
| Maximum Operating Frequency | 166.67 MHz | — |
| Propagation Delay | 0.4 ns | — |
| Packhaging / Kaso | 672-BBGA (27 x 27 mm, 1.0 mm pitch, FineLine BGA) | — |
| Uri ng Pagpapasok | Surface Mount | — |
| Temperature na Operasyon | 0 °C to +70 °C (commercial) | 0 °C to 70 °C (commercial) |
| Configuration Memory | SRAM-based (volatile, requires external configuration device) | — |
| Number of PLLs | 4 | — |
| Tindminan RoHS | [DATA_NEEDED: rohs status] | Unknown (legacy Altera non-RoHS device) |
| Level ng MSL | [DATA_NEEDED: MSL level] | — |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Family | — | FLEX 10KE |
| Typical Gates | — | 250,000 |
| Logic Elements | — | [DATA_NEEDED: exact LE count] |
| User I/O Pins | — | 470 |
| Embedded Array Blocks (EABs) | — | 12 |
| EAB Dual-Port Width | — | Up to 16-bit |
| Maximum EAB Memory | — | [DATA_NEEDED: bits per EAB] |
| Propagation Delay (tpd) | — | 0.4 ns (typical, -3 speed grade) |
| Core Supply Voltage | — | 2.5 V |
| I/O Supply Voltage | — | 2.5 V / 3.3 V (multiVolt I/O) |
| Packhaging | — | 672-ball FineLine BGA, 1.27 mm pitch |
| Configuration Interface | — | JTAG / ByteBlaster (EPC2/EPC8 PROM) |
| Design Entry | — | EDIF 2 0 0 / 3 0 0, LPM, VHDL, Verilog |