EPF10K200EFC672-3 vs EPF10K250EFI672-3 Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EPF10K200EFC672-3 disebabkan oleh Intel dan EPF10K250EFI672-3 disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Pengandingan Spesifikasi

Parametr EPF10K200EFC672-3 EPF10K250EFI672-3
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Obsolete NRND
Series FLEX 10KE —
Number of Logic Elements / Cells 9,984 —
Number of LABs / CLBs 1248 —
Total RAM Bits 98,304 bits (12 EABs of 8 Kbits) —
Number of I/O 470 —
Number of Gates (typical) 200,000 —
Supply Voltage - Operating 2.3 V to 2.7 V (2.5 V nominal) —
Process Technology 0.22 µm CMOS CMOS, SRAM-based configuration
Maximum Operating Frequency 166.67 MHz —
Propagation Delay 0.4 ns —
Kemasan / Case 672-BBGA (27 x 27 mm, 1.0 mm pitch, FineLine BGA) —
Jenis Pemasangan Surface Mount —
Suhu Operasi 0 °C to +70 °C (commercial) 0 °C to 70 °C (commercial)
Configuration Memory SRAM-based (volatile, requires external configuration device) —
Number of PLLs 4 —
Status RoHS [DATA_NEEDED: rohs status] Unknown (legacy Altera non-RoHS device)
Aras MSL [DATA_NEEDED: MSL level] —
Lead-Free [DATA_NEEDED: lead-free status] —
Family — FLEX 10KE
Typical Gates — 250,000
Logic Elements — [DATA_NEEDED: exact LE count]
User I/O Pins — 470
Embedded Array Blocks (EABs) — 12
EAB Dual-Port Width — Up to 16-bit
Maximum EAB Memory — [DATA_NEEDED: bits per EAB]
Propagation Delay (tpd) — 0.4 ns (typical, -3 speed grade)
Core Supply Voltage — 2.5 V
I/O Supply Voltage — 2.5 V / 3.3 V (multiVolt I/O)
Kemasan — 672-ball FineLine BGA, 1.27 mm pitch
Configuration Interface — JTAG / ByteBlaster (EPC2/EPC8 PROM)
Design Entry — EDIF 2 0 0 / 3 0 0, LPM, VHDL, Verilog

Laporan Datasheet & Sumber

Lihat Semua Produk Buat BOQ Minta Bao Harga