EPF10K200EGC599-1 vs EPF10K250EGC599-1 Comparison
Detailed side-by-side comparison of EPF10K200EGC599-1 by Intel and EPF10K250EGC599-1 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EPF10K200EGC599-1 - FLEX 10KE 200K Gates FPGA 599-CPGA | Intel / Altera
EPF10K200EGC599-1 ⚠ Last Time BuySpecification Comparison
| Parameter | EPF10K200EGC599-1 | EPF10K250EGC599-1 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Last Time Buy | NRND |
| Family | FLEX 10KE | — |
| Logic Elements (LEs) | 9,984 | — |
| Typical Gates | 200,000 | — |
| Embedded Array Blocks (EABs) | 470 | — |
| Total RAM Bits | 98,304 | — |
| Core Supply Voltage | 2.375 V to 2.625 V | — |
| I/O Voltage Tolerance | 5.0 V tolerant | — |
| Pin Count | 599 | 599 |
| Package Type | 599-BCPGA (Ceramic Pin Grid Array) | — |
| Package Dimensions | 62.48 x 62.48 mm | — |
| Mounting Type | Through-Hole (Socket or Solder) | Through-Hole (PGA) |
| Operating Temperature | 0C to +70C (Commercial) | 0C to +70C (Commercial) |
| Programming Interface | JTAG (IEEE 1149.1) | JTAG (IEEE 1149.1), passive serial |
| PLLs | 4 | — |
| RoHS Status | [DATA_NEEDED: RoHS status of ceramic CPGA variant] | unknown (ceramic HIPGA package historically non-RoHS) |
| Product Type | — | FPGA (Field-Programmable Gate Array) |
| Series | — | FLEX 10K |
| Logic Elements | — | 40,960 |
| Equivalent Gates | — | 250,000 |
| Flip-Flops | — | 12,160 |
| User I/O Pins | — | 470 |
| Embedded Array Blocks (EAB) | — | 20 (2 Kbit each) |
| Package | — | 599-BPGA / HIPGA-599 (Ceramic Pin Grid Array) |
| Configuration | — | SRAM (volatile), serial/parallel EPROM |
| Process Node | — | 0.42 µm CMOS |
| I/O Standard Support | — | 5.0 V PCI, LVTTL, LVCMOS |
| MSL Level | — | [DATA_NEEDED: moisture sensitivity level] |