EPF10K200EGC599-1 vs EPF10K250EGC599-1 Comparison

Detailed side-by-side comparison of EPF10K200EGC599-1 by Intel and EPF10K250EGC599-1 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF10K200EGC599-1 EPF10K250EGC599-1
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Last_time_buy Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $880.00 $162.00
Family FLEX 10KE β€”
Logic Elements (LEs) 9,984 β€”
Typical Gates 200,000 β€”
Embedded Array Blocks (EABs) 470 β€”
Total RAM Bits 98,304 β€”
Core Supply Voltage 2.375 V to 2.625 V β€”
I/O Voltage Tolerance 5.0 V tolerant β€”
Pin Count 599 599
Package Type 599-BCPGA (Ceramic Pin Grid Array) β€”
Package Dimensions 62.48 x 62.48 mm β€”
Mounting Type Through-Hole (Socket or Solder) Through-Hole (PGA)
Operating Temperature 0C to +70C (Commercial) 0C to +70C (Commercial)
Programming Interface JTAG (IEEE 1149.1) JTAG (IEEE 1149.1), passive serial
PLLs 4 β€”
RoHS Status [DATA_NEEDED: RoHS status of ceramic CPGA variant] unknown (ceramic HIPGA package historically non-RoHS)
Product Type β€” FPGA (Field-Programmable Gate Array)
Series β€” FLEX 10K
Logic Elements β€” 40,960
Equivalent Gates β€” 250,000
Flip-Flops β€” 12,160
User I/O Pins β€” 470
Embedded Array Blocks (EAB) β€” 20 (2 Kbit each)
Package β€” 599-BPGA / HIPGA-599 (Ceramic Pin Grid Array)
Configuration β€” SRAM (volatile), serial/parallel EPROM
Process Node β€” 0.42 Β΅m CMOS
I/O Standard Support β€” 5.0 V PCI, LVTTL, LVCMOS
MSL Level β€” [DATA_NEEDED: moisture sensitivity level]

Datasheets & Resources

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