EPF10K200EGC599-1 vs EPF10K250EGC599-1 比較

詳細並排比較 EPF10K200EGC599-1 由 Intel 與 EPF10K250EGC599-1 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Intel
EPF10K200EGC599-1 EPF10K200EGC599-1 - FLEX 10KE 200K Gates FPGA 599-CPGA | Intel / Altera

EPF10K200EGC599-1 - FLEX 10KE 200K Gates FPGA 599-CPGA | Intel / Altera

EPF10K200EGC599-1 ⚠ 最後購買機會

規格比較

參數 EPF10K200EGC599-1 EPF10K250EGC599-1
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 最後購買 NRND
Family FLEX 10KE —
Logic Elements (LEs) 9,984 —
Typical Gates 200,000 —
Embedded Array Blocks (EABs) 470 —
Total RAM Bits 98,304 —
Core Supply Voltage 2.375 V to 2.625 V —
I/O Voltage Tolerance 5.0 V tolerant —
腳位數 599 599
Package Type 599-BCPGA (Ceramic Pin Grid Array) —
Package Dimensions 62.48 x 62.48 mm —
安裝類型 Through-Hole (Socket or Solder) Through-Hole (PGA)
工作溫度 0C to +70C (Commercial) 0C to +70C (Commercial)
Programming Interface JTAG (IEEE 1149.1) JTAG (IEEE 1149.1), passive serial
PLLs 4 —
RoHS 狀態 [DATA_NEEDED: RoHS status of ceramic CPGA variant] unknown (ceramic HIPGA package historically non-RoHS)
Product Type — FPGA (Field-Programmable Gate Array)
Series — FLEX 10K
Logic Elements — 40,960
Equivalent Gates — 250,000
Flip-Flops — 12,160
User I/O Pins — 470
Embedded Array Blocks (EAB) — 20 (2 Kbit each)
封裝 — 599-BPGA / HIPGA-599 (Ceramic Pin Grid Array)
Configuration — SRAM (volatile), serial/parallel EPROM
Process Node — 0.42 µm CMOS
I/O Standard Support — 5.0 V PCI, LVTTL, LVCMOS
MSL 等級 — [DATA_NEEDED: moisture sensitivity level]

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