EPF10K250EBC600-3 vs EPF10K200EBC600-2 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K250EBC600-3 sa pamamagitan ng Intel at EPF10K200EBC600-2 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EPF10K250EBC600-3 EPF10K200EBC600-2
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete Obsolete
Family FLEX 10KE —
Logic Elements 12,160 LEs —
Typical Gates 250,000 —
Maximum User I/O 470 470 pins
Embedded Array Blocks (EABs) 12 (each 2 Kbits) —
Total Embedded Memory 24 Kbits (RAM) —
PLLs (Phase-Locked Loops) 4 —
Dedicated Clock Inputs 6 —
Speed Grade -3 —
Core Supply Voltage 3.3 V —
I/O Supply Voltage 3.3 V (5 V tolerant) —
Packhaging 600-ball FineLine BGA —
Configuration Mode Passive Serial / Passive Parallel / JTAG —
Boundary Scan IEEE 1149.1 (JTAG) —
Temperature na Operasyon [DATA_NEEDED: operating temperature range] 0°C to +70°C (Commercial)
Process Technology SRAM-based CMOS 0.30 µm CMOS
Series — FLEX-10KE
Logic Family — CMOS (SRAM-based)
Typical Gate Count — 200,000 gates
Logic Elements (LEs) — 9984
Logic Array Blocks (LABs) — 1248
Embedded Memory (EAB) — 98304 bits (96 Kbits)
Propagation Delay — 0.4 ns
Volte ng Pagbibigay — 2.3 V to 2.7 V (core), 2.5/3.3 V (I/O)
I/O Standards — LVTTL, LVCMOS, PCI, GTL+
Package Type — 600-ball BGA (BGA-600)
Package Dimensions — 45 × 45 mm
Ball Pitch — 1.27 mm
Package Height — 1.1 mm max
Uri ng Pagpapasok — Surface Mount
Configuration Method — JTAG (IEEE 1149.1), EPC2 serial PROM
Part Status — Obsolete
Tindminan RoHS — unknown

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