EPF10K250EFC672-1 vs EPF10K250EFI672-3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K250EFC672-1 sa pamamagitan ng Intel at EPF10K250EFI672-3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EPF10K250EFC672-1 | EPF10K250EFI672-3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | NRND |
| Family | FLEX 10KE | FLEX 10KE |
| Logic Family | CMOS | — |
| Typical System Gates | 250,000 | — |
| Maximum User I/Os | 470 | — |
| Total Pins | 672 | — |
| Package Type | BGA-672 | — |
| Package Size | 45 x 45 mm | — |
| Ball Pitch | 1.27 mm | — |
| Package Shape | Square | — |
| Terminal Form | Ball | — |
| Temperature na Operasyon | 0C to +70C (Commercial) | 0 °C to 70 °C (commercial) |
| Propagation Delay | 0.4 ns | — |
| Programming Technology | In-system, SRAM-based | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | Unknown (legacy Altera non-RoHS device) |
| Uri ng Pagpapasok | Surface Mount | — |
| Configuration Interface | Serial (passive/active) | JTAG / ByteBlaster (EPC2/EPC8 PROM) |
| Speed Grade | -1 | — |
| Typical Gates | — | 250,000 |
| Logic Elements | — | [DATA_NEEDED: exact LE count] |
| User I/O Pins | — | 470 |
| Embedded Array Blocks (EABs) | — | 12 |
| EAB Dual-Port Width | — | Up to 16-bit |
| Maximum EAB Memory | — | [DATA_NEEDED: bits per EAB] |
| Propagation Delay (tpd) | — | 0.4 ns (typical, -3 speed grade) |
| Core Supply Voltage | — | 2.5 V |
| I/O Supply Voltage | — | 2.5 V / 3.3 V (multiVolt I/O) |
| Packhaging | — | 672-ball FineLine BGA, 1.27 mm pitch |
| Process Technology | — | CMOS, SRAM-based configuration |
| Design Entry | — | EDIF 2 0 0 / 3 0 0, LPM, VHDL, Verilog |