EPF10K250EFC672-3 vs EPF10K250EBC600-3 Comparison
Detailed side-by-side comparison of EPF10K250EFC672-3 by Intel and EPF10K250EBC600-3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPF10K250EFC672-3 | EPF10K250EBC600-3 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Obsolete |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $99.50 | $205.00 |
| Product Type | FPGA (Field Programmable Gate Array) | β |
| Family | FLEX 10KE | FLEX 10KE |
| Maximum Typical Gates | 250,000 | β |
| Logic Elements (LEs) | 12,160 | β |
| Embedded Memory (EAB) | 655,360 bits (80 EABs x 2,048 bits each) | β |
| Logic Array Blocks (LABs) | 392 (8 LEs per LAB) | β |
| User I/O Pins | 470 | β |
| Core Supply Voltage | 2.5 V | 3.3 V |
| I/O Supply Voltage | MultiVolt: 1.5 V / 1.8 V / 2.5 V / 3.3 V | 3.3 V (5 V tolerant) |
| Speed Grade | -3 (fastest) | -3 |
| Temperature Grade | Commercial (0C to +70C) | β |
| Package | 672-ball FineLine BGA (FC) | 600-ball FineLine BGA |
| Ball Pitch | 1.0 mm | β |
| Configuration Mode | JTAG (IEEE 1149.1) ISP / serial / parallel, external EPCx PROM | Passive Serial / Passive Parallel / JTAG |
| Process Technology | 0.25 um CMOS, 5-layer metal | SRAM-based CMOS |
| Mounting Type | Surface Mount | β |
| RoHS Status | [DATA_NEEDED: RoHS status - 672-FBGA part is non-RoHS per Fly-Wing listing] | β |
| Lead-Free | [DATA_NEEDED: lead-free status] | β |
| Logic Elements | β | 12,160 LEs |
| Typical Gates | β | 250,000 |
| Maximum User I/O | β | 470 |
| Embedded Array Blocks (EABs) | β | 12 (each 2 Kbits) |
| Total Embedded Memory | β | 24 Kbits (RAM) |
| PLLs (Phase-Locked Loops) | β | 4 |
| Dedicated Clock Inputs | β | 6 |
| Boundary Scan | β | IEEE 1149.1 (JTAG) |
| Operating Temperature | β | [DATA_NEEDED: operating temperature range] |