EPF10K250EFC672-3 vs EPF10K250EBC600-3 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K250EFC672-3 sa pamamagitan ng Intel at EPF10K250EBC600-3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EPF10K250EFC672-3 EPF10K250EBC600-3
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete Obsolete
Product Type FPGA (Field Programmable Gate Array) —
Family FLEX 10KE FLEX 10KE
Maximum Typical Gates 250,000 —
Logic Elements (LEs) 12,160 —
Embedded Memory (EAB) 655,360 bits (80 EABs x 2,048 bits each) —
Logic Array Blocks (LABs) 392 (8 LEs per LAB) —
User I/O Pins 470 —
Core Supply Voltage 2.5 V 3.3 V
I/O Supply Voltage MultiVolt: 1.5 V / 1.8 V / 2.5 V / 3.3 V 3.3 V (5 V tolerant)
Speed Grade -3 (fastest) -3
Temperature Grade Commercial (0C to +70C) —
Packhaging 672-ball FineLine BGA (FC) 600-ball FineLine BGA
Ball Pitch 1.0 mm —
Configuration Mode JTAG (IEEE 1149.1) ISP / serial / parallel, external EPCx PROM Passive Serial / Passive Parallel / JTAG
Process Technology 0.25 um CMOS, 5-layer metal SRAM-based CMOS
Uri ng Pagpapasok Surface Mount —
Tindminan RoHS [DATA_NEEDED: RoHS status - 672-FBGA part is non-RoHS per Fly-Wing listing] —
Lead-Free [DATA_NEEDED: lead-free status] —
Logic Elements — 12,160 LEs
Typical Gates — 250,000
Maximum User I/O — 470
Embedded Array Blocks (EABs) — 12 (each 2 Kbits)
Total Embedded Memory — 24 Kbits (RAM)
PLLs (Phase-Locked Loops) — 4
Dedicated Clock Inputs — 6
Boundary Scan — IEEE 1149.1 (JTAG)
Temperature na Operasyon — [DATA_NEEDED: operating temperature range]

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