EPF10K250EFC672-3 vs EPF10K250EFC672-2 比較
詳細並排比較 EPF10K250EFC672-3 由 Intel 與 EPF10K250EFC672-2 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EPF10K250EFC672-3 | EPF10K250EFC672-2 |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | Obsolete | NRND |
| Product Type | FPGA (Field Programmable Gate Array) | — |
| Family | FLEX 10KE | FLEX 10KE |
| Maximum Typical Gates | 250,000 | — |
| Logic Elements (LEs) | 12,160 | — |
| Embedded Memory (EAB) | 655,360 bits (80 EABs x 2,048 bits each) | — |
| Logic Array Blocks (LABs) | 392 (8 LEs per LAB) | — |
| User I/O Pins | 470 | — |
| Core Supply Voltage | 2.5 V | 2.3 V (typical 2.5 V) |
| I/O Supply Voltage | MultiVolt: 1.5 V / 1.8 V / 2.5 V / 3.3 V | — |
| Speed Grade | -3 (fastest) | — |
| Temperature Grade | Commercial (0C to +70C) | — |
| 封裝 | 672-ball FineLine BGA (FC) | 672-BGA (FineLine BGA), 45 x 45 mm, 1.27 mm pitch |
| Ball Pitch | 1.0 mm | — |
| Configuration Mode | JTAG (IEEE 1149.1) ISP / serial / parallel, external EPCx PROM | — |
| Process Technology | 0.25 um CMOS, 5-layer metal | — |
| 安裝類型 | Surface Mount | Surface Mount |
| RoHS 狀態 | [DATA_NEEDED: RoHS status - 672-FBGA part is non-RoHS per Fly-Wing listing] | Non-RoHS Compliant (per Fly-Wing listing) |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Logic Elements | — | 12,480 |
| Typical Gates | — | 250,000 |
| Embedded Array Blocks (EABs) | — | 20 |
| Maximum User RAM Bits | — | 40,960 |
| User I/Os | — | 470 |
| 腳位數 | — | 672 |
| Propagation Delay | — | 0.4 ns |
| 工作溫度 | — | 0 C to +70 C (Commercial) |
| I/O Standard Support | — | 1.8 V, 2.5 V, 3.3 V (multi-volt I/O) |
| Logic Family | — | CMOS, SRAM-based |
| Configuration | — | SRAM, in-system programmable (ISP) via JTAG |
| Boundary Scan | — | IEEE 1149.1 (JTAG) compliant |