EPF6016BC256-3N vs EPF6016BC256-3 Comparison

Detailed side-by-side comparison of EPF6016BC256-3N by Intel and EPF6016BC256-3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF6016BC256-3N EPF6016BC256-3
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Family FLEX 6000 FLEX 6000
Device Type Field Programmable Gate Array (FPGA) —
Logic Elements (LEs) 1320 —
Typical Gate Count 16,000 gates —
User I/Os 204 —
Internal Frequency (max) 125 MHz —
Process Technology 0.42 µm CMOS 0.42 µm CMOS SRAM
Supply Voltage 5 V —
Package 256-BGA (FineLine) 256-ball FineLine BGA
Speed Grade -3 —
Temperature Range 0 °C to +85 °C (industrial, N suffix) —
Configuration Method Serial configuration EPROM —
Mounting Type Surface Mount (BGA) Surface Mount
Packaging Tray —
RoHS Status [DATA_NEEDED: RoHS status] [DATA_NEEDED: RoHS compliance status]
Logic Elements (typical) — 1,320 cells
Usable Gates — 16,000 gates
User I/O Pins — 204
Maximum Internal Frequency — 172 MHz
Core Supply Voltage — 5.0 V
I/O Standard — 5.0 V TTL/CMOS
Pin Count — 256
Operating Temperature — 0 °C to +85 °C (commercial)
Configuration — SRAM, in-system programmable
Boundary Scan — JTAG IEEE 1149.1

Datasheets & Resources

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