EPF8820ABC225-4 vs EPF8636AQC208-3 Comparison

Detailed side-by-side comparison of EPF8820ABC225-4 by Intel and EPF8636AQC208-3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF8820ABC225-4 EPF8636AQC208-3
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Last Time Buy
Family FLEX 8000 FLEX 8000
Device Logic Elements 672 cells —
Typical Gates 8,000 —
Logic Array Blocks (LABs) 84 63
User I/Os 152 136
Process Technology 0.42 µm CMOS CMOS
Supply Voltage 4.75 V to 5.25 V (5 V nominal) 5 V
Operating Frequency 125 MHz —
Speed Grade -4 -3
Package 225-ball BGA (BC225), 19 x 19 mm 208-pin BFQFP (PQFP)
Package Type Surface-mount BGA, ball grid array —
Operating Temperature 0 °C to +70 °C (commercial) 0C to 70C (Commercial)
Configuration Method SRAM (volatile, reconfigure at power-up) —
LUT Architecture 4-input look-up table with programmable register —
RoHS Status unknown Non-compliant (legacy)
Lead-Free unknown —
MSL Level [DATA_NEEDED: MSL moisture sensitivity level] —
Logic Elements — 504
Usable Gates — Approximately 6,000
Configuration Memory — SRAM (volatile, ICR via EPROM)
Terminal Form — Gull Wing
Mounting Type — Surface Mount
Package Code — FQFP / PQFP

Datasheets & Resources

Browse All Products Create BOM Request Quote