EPF8636AQC208-3 - FLEX 8000 FPGA 6K Gates 136 I/O QFP208 | Intel / Altera
MPN: EPF8636AQC208-3 ⚠ Last Time Buy| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $40.32 | $40.32 |
| 6 | $40.32 | $241.92 |
| 10 | $36.5 | $365.00 |
| 50 | $32 | $1,600.00 |
| 100 | $28 | $2,800.00 |
Drop-in alternatives for EPF8636AQC208-3 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EPF8636AQC208-2
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View Datasheet →EPF8636AQC208-4
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View Datasheet →EPF8636AQC208-3 Maximum Ratings & Electrical Characteristics
| Family | FLEX 8000 |
| Logic Elements | 504 |
| Logic Array Blocks (LABs) | 63 |
| Usable Gates | Approximately 6,000 |
| User I/Os | 136 |
| Configuration Memory | SRAM (volatile, ICR via EPROM) |
| Supply Voltage | 5 V |
| Operating Temperature | 0C to 70C (Commercial) |
| Speed Grade | -3 |
| Package | 208-pin BFQFP (PQFP) |
| Terminal Form | Gull Wing |
| Mounting Type | Surface Mount |
| Package Code | FQFP / PQFP |
| RoHS Status | Non-compliant (legacy) |
| Process Technology | CMOS |
EPF8636AQC208-3 fqfp / pqfp Pin Configuration Guide
Complete pinout information for EPF8636AQC208-3 (fqfp / pqfp package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPF8636AQC208-3.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPF8636AQC208-3 is suitable for 6 applications: ASIC Prototyping, Bus-Interface Glue Logic, Industrial Control State Machines, Telecommunication Backplane Glue Logic, Legacy System Refresh and Sustainment, Peripheral and I/O Expansion Cards.
ASIC Prototyping
The EPF8636AQC208-3 is well-suited for ASIC prototyping where designers need a reprogrammable platform to validate logic before committing to mask ROM. With 504 logic elements across 63 LABs and 136 user I/Os, the device provides sufficient capacity for prototyping sub-modules of larger ASIC designs. The 5 V supply and commercial 0C-70C temperature range match typical ASIC verification environments, while the in-circuit reconfigurability (ICR) via SRAM/EPROM allows rapid design iteration during bring-up. Engineers commonly use the MAX+PLUS II or Quartus toolchain to map ASIC RTL (VHDL/Verilog) onto the FLEX 8000 architecture for functional verification at clock rates up to approximately 80 MHz in the -3 speed grade.
Recommended
Bus-Interface Glue Logic
The EPF8636AQC208-3 excels at bus-interface glue-logic applications such as ISA-to-local-bus bridging, address decoding, wait-state generation, and bus-width conversion. The 136 user I/O pins distributed across four I/O banks easily handle 32-bit datapaths plus control signals, while the SRAM-based configuration enables late-stage design changes without board rework. The 5 V I/O compatibility matches legacy ISA, PCI-5V, and VMEbus interfaces common in industrial PC and embedded systems. Per the Altera FLEX 8000 datasheet, the device supports 5 V PCI compliant I/O, making it suitable for industrial backplanes and PCI-5V add-in card designs.
Recommended
Industrial Control State Machines
Industrial control systems benefit from the EPF8636AQC208-3's combination of wide I/O count, deterministic interconnect timing, and 5 V tolerance. The device commonly implements multi-state controllers for motor drives, PLC logic, sensor-fusion pre-processing, and HMI panel interfaces. The commercial 0C-70C temperature range covers most factory-floor environments, while the 208-pin PQFP package provides the I/O headroom required for parallel sensor inputs and actuator outputs. Designers can leverage the Altera FLEX 8000 reference designs for state-machine encoding patterns to minimize logic-element utilization and maximize achievable state-clock frequency.
Recommended
Telecommunication Backplane Glue Logic
Telecommunication backplanes require wide-parallel datapath routing, multi-protocol bridging, and reliable operation in thermally stable environments - all strengths of the EPF8636AQC208-3. The 136 I/O pins accommodate T1/E1 framer interfaces, HDLC controllers, and parallel bus muxes between line cards and switch fabrics. The FLEX 8000 family's continuous FastTrack interconnect provides predictable delays critical for backplane timing budgets. The 5 V supply matches legacy telecom -48V-to-5V isolated supply rails, while the in-circuit reconfigurability supports field firmware updates across deployed equipment.
Recommended
Legacy System Refresh and Sustainment
The EPF8636AQC208-3 is a primary candidate for legacy system refresh and sustainment applications where original FLEX 8000 designs are being maintained, repaired, or replicated. Many industrial, military, and aerospace systems designed in the late 1990s and early 2000s used FLEX 8000 FPGAs and now require replacement parts for ongoing maintenance. Rochester Electronics and authorized brokers specialize in long-term sustainment of these mature Altera/Intel FPGAs. The EPF8636AQC208-3's pin-compatibility across the -2, -3, and -4 speed grades simplifies board-level substitution, and the 208-pin PQFP footprint allows drop-in repair on legacy PCBs without redesign.
Recommended
Peripheral and I/O Expansion Cards
The EPF8636AQC208-3 is commonly used on peripheral and I/O expansion cards to implement custom logic between a host bus and external peripherals. With 136 user I/Os, the device can drive multi-port serial interfaces, parallel ADC/DAC interfaces, custom DMA controllers, and proprietary peripheral protocols. The 5 V PCI-compliant I/O matches legacy peripheral-card form factors, while the 208-pin PQFP package is compatible with standard PCI-5V card layouts. Designers use the FLEX 8000 LAB carry chains for fast address counters and the cascade chains for wide comparators used in peripheral arbitration.
Recommended
Recommended Products Summary
Engineering reference data for EPF8636AQC208-3 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPF8636AQC208-2 | EPF8636AQC208-4 | EPF8636AQC160-3 | EPF8636AQC160-4 | EPF8452AQC160-3 |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 208-pin PQFP (BFQFP) | 208-pin PQFP (BFQFP) - same | 208-pin PQFP (BFQFP) - same | 160-pin PQFP - different | 160-pin PQFP - different | 160-pin PQFP - different |
| Family | FLEX 8000 | FLEX 8000 - same | FLEX 8000 - same | FLEX 8000 - same | FLEX 8000 - same | FLEX 8000 - same |
| Speed Grade | -3 | -2 (slower) | -4 (faster) | -3 | -4 | -3 |
| Logic Elements | 504 | 504 | 504 | 504 | 504 | [DATA_NEEDED] |
| User I/Os | 136 | 136 | 136 | [DATA_NEEDED: likely 100-120] | [DATA_NEEDED: likely 100-120] | [DATA_NEEDED] |
| Supply Voltage | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| RoHS Status | Non-compliant | Non-compliant | Non-compliant | Non-compliant | Non-compliant | Non-compliant |
| Lifecycle Status | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy | Last Time Buy |
Key Differentiators
- Higher logic capacity within FLEX 8000 family (vs EPF8452AQC160-3)
- 208-pin PQFP package with maximum I/O count for the family (vs EPF8636AQC160-3 (160-pin package))
- Mid-tier -3 speed grade balances cost and performance (vs EPF8636AQC208-2 (slower) and EPF8636AQC208-4 (faster))
Design Notes
The EPF8636AQC208-3 requires a well-decoupled 5 V supply per the FLEX 8000 reference design. Place a 100 uF to 220 uF bulk tantalum or low-ESR electrolytic capacitor near the board's 5 V entry point, with 0.1 uF and 0.01 uF ceramic capacitors adjacent to every VCC and GND pin pair on the device. Multiple VCC pins are distributed around the package - each must be decoupled individually. Inrush current during SRAM configuration can reach 500 mA; ensure the 5 V regulator has adequate transient response. The I/O banks draw additional current when driving 5 V PCI loads - budget up to 1 A total worst-case supply current for the EPF8636AQC208-3 at full I/O utilization.
PCB layout for the 208-pin PQFP package must accommodate the 0.5 mm lead pitch with 4-layer board stackup recommended. Route all clock signals (CLK0-CLK3) on the inner layers with ground reference to minimize crosstalk, and keep configuration signals (nCONFIG, nSTATUS, CONF_DONE) short and away from switching I/O. Maintain continuous ground plane under the device to provide a low-impedance return path for the high-speed I/O. Per the Altera application note AN-74, unused I/O pins should be configured as outputs driving ground (not left floating) to prevent supply-current transients during configuration. The exposed thermal pad is not present on PQFP packages - thermal management relies on copper pours on inner layers connected to the GND pins.
Common pitfalls when designing with the EPF8636AQC208-3 include: (1) Failing to connect the TRST pin - it must be pulled low through 1 kohm or actively driven for JTAG to function reliably. (2) Attempting to use 3.3 V signals on I/O banks without proper level translation - all I/O banks are 5 V tolerant, but inputs above VCC + 0.5 V can cause latch-up. (3) Confusing the -3 speed grade timing across FLEX 8000 device densities - timing models differ between EPF8282, EPF8452, and EPF8636 even at the same speed grade. (4) Forgetting that FLEX 8000 SRAM configuration is volatile - the device loses configuration on power-down and must be reconfigured on every power-up via the configuration EPROM or download cable. (5) Not budgeting for the configuration time - a full EPF8636 configuration can take up to 100 ms, affecting system startup timing.
Compliance Information
RoHS non-compliant per alterachips.com listing - legacy FLEX 8000 package uses SnPb solder terminations. Not AEC-Q100 qualified; commercial temperature grade only. REACH and conflict minerals status not disclosed in available data - set to unknown.