EPF8820ABC225-4 vs EPF8820ABC225-3 Comparison

Detailed side-by-side comparison of EPF8820ABC225-4 by Intel and EPF8820ABC225-3 by Altera. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EPF8820ABC225-4 EPF8820ABC225-3
Brand Intel Altera
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $14.20 $20.00
Family FLEX 8000 FLEX 8000
Device Logic Elements 672 cells β€”
Typical Gates 8,000 β€”
Logic Array Blocks (LABs) 84 β€”
User I/Os 152 β€”
Process Technology 0.42 Β΅m CMOS 0.42 micron CMOS
Supply Voltage 4.75 V to 5.25 V (5 V nominal) 5 V (core); 3.3 V or 5 V I/O
Operating Frequency 125 MHz β€”
Speed Grade -4 -3
Package 225-ball BGA (BC225), 19 x 19 mm 225-Ball BGA
Package Type Surface-mount BGA, ball grid array β€”
Operating Temperature 0 Β°C to +70 Β°C (commercial) [DATA_NEEDED: industrial/commercial temperature grade]
Configuration Method SRAM (volatile, reconfigure at power-up) In-Circuit Reconfigurability (ICR) via external devices or intelligent controllers
LUT Architecture 4-input look-up table with programmable register β€”
RoHS Status unknown [DATA_NEEDED: pre-RoHS legacy part, likely non-compliant]
Lead-Free unknown β€”
MSL Level [DATA_NEEDED: MSL moisture sensitivity level] β€”
Logic Elements β€” 672
Usable Gates β€” 8,000 (up to 16,000 maximum)
Registers β€” 1,500
Maximum Internal Frequency β€” 125 MHz
Maximum Clock Frequency β€” 385 MHz (per Microchip USA listing)
Mounting Type β€” Surface Mount
Boundary Scan β€” JTAG IEEE 1149.1 compliant

Datasheets & Resources

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