EPF8820ABC225-4 vs EPF8820ABC225-3 Comparison
Detailed side-by-side comparison of EPF8820ABC225-4 by Intel and EPF8820ABC225-3 by Altera. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPF8820ABC225-4 | EPF8820ABC225-3 |
|---|---|---|
| Brand | Intel | Altera |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Obsolete |
| Family | FLEX 8000 | FLEX 8000 |
| Device Logic Elements | 672 cells | — |
| Typical Gates | 8,000 | — |
| Logic Array Blocks (LABs) | 84 | — |
| User I/Os | 152 | — |
| Process Technology | 0.42 µm CMOS | 0.42 micron CMOS |
| Supply Voltage | 4.75 V to 5.25 V (5 V nominal) | 5 V (core); 3.3 V or 5 V I/O |
| Operating Frequency | 125 MHz | — |
| Speed Grade | -4 | -3 |
| Package | 225-ball BGA (BC225), 19 x 19 mm | 225-Ball BGA |
| Package Type | Surface-mount BGA, ball grid array | — |
| Operating Temperature | 0 °C to +70 °C (commercial) | [DATA_NEEDED: industrial/commercial temperature grade] |
| Configuration Method | SRAM (volatile, reconfigure at power-up) | In-Circuit Reconfigurability (ICR) via external devices or intelligent controllers |
| LUT Architecture | 4-input look-up table with programmable register | — |
| RoHS Status | unknown | [DATA_NEEDED: pre-RoHS legacy part, likely non-compliant] |
| Lead-Free | unknown | — |
| MSL Level | [DATA_NEEDED: MSL moisture sensitivity level] | — |
| Logic Elements | — | 672 |
| Usable Gates | — | 8,000 (up to 16,000 maximum) |
| Registers | — | 1,500 |
| Maximum Internal Frequency | — | 125 MHz |
| Maximum Clock Frequency | — | 385 MHz (per Microchip USA listing) |
| Mounting Type | — | Surface Mount |
| Boundary Scan | — | JTAG IEEE 1149.1 compliant |