EPM1270F256I5N vs EPM1270F256I5 Comparison
Detailed side-by-side comparison of EPM1270F256I5N by Intel and EPM1270F256I5 by Altera. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EPM1270F256I5N | EPM1270F256I5 |
|---|---|---|
| Brand | Intel | Altera |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Series | MAX II | EPM1270 |
| Family | MAX II (EPM1270) | — |
| Device Type | CPLD - Complex Programmable Logic Device | — |
| Macro Cells | 980 | — |
| Logic Elements | 1270 | 1270 |
| User I/O Pins | 212 | 212 (max) |
| User Flash Memory | 8 Kbits | 8 Kbits |
| Maximum Operating Frequency | 201.1 MHz | — |
| Pin-to-Pin Logic Delay | 6.2 ns (I5 speed grade) | — |
| External Supply Voltage | 2.5 V / 3.3 V | — |
| Internal Core Voltage | 1.8 V (on-chip regulator) | — |
| I/O Bank Support | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) + 3.3 V PCI-compliant bank | — |
| Process Technology | 0.18-micron Flash-based CMOS | 0.18 µm |
| Configuration Memory | Non-volatile Flash (instant-on) | — |
| Programming Interface | JTAG IEEE 1149.1 (boundary-scan + ISP) | JTAG (IEEE 1149.1) / ISP |
| Package | 256-ball FBGA (FineLine BGA), 17 x 17 mm | 256-ball FBGA (FineLine BGA) |
| Operating Temperature | -40C to +100C (TJ), industrial | -40 °C to +100 °C (industrial, "I") |
| Speed Grade | I5 (industrial, 6.2 ns tPD) | 5 |
| Mounting Type | Surface Mount (SMT, BGA) | Surface Mount |
| RoHS Status | Compliant | [DATA_NEEDED: RoHS status] |
| Halogen Free | Compliant (per GlobalSpec) | — |
| Country of Origin | Malaysia / Republic of Korea | — |
| Device Family | — | MAX II |
| Macrocell Count | — | 980 |
| Pin/Package Count | — | 256 |
| Supply Voltage (VCCINT) | — | 1.8 V |
| I/O Supply Voltage (VCCIO) | — | 2.5 V / 3.3 V |
| Maximum Internal Frequency | — | 201.1 MHz |
| Pin-to-Pin Delay (tPD) | — | 6.2 ns |