EPM1270F256I5N vs EPM1270F256I5 Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EPM1270F256I5N disebabkan oleh Intel dan EPM1270F256I5 disebabkan oleh Altera. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EPM1270F256I5N | EPM1270F256I5 |
|---|---|---|
| Merek | Intel | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | MAX II | EPM1270 |
| Family | MAX II (EPM1270) | — |
| Device Type | CPLD - Complex Programmable Logic Device | — |
| Macro Cells | 980 | — |
| Logic Elements | 1270 | 1270 |
| User I/O Pins | 212 | 212 (max) |
| User Flash Memory | 8 Kbits | 8 Kbits |
| Maximum Operating Frequency | 201.1 MHz | — |
| Pin-to-Pin Logic Delay | 6.2 ns (I5 speed grade) | — |
| External Supply Voltage | 2.5 V / 3.3 V | — |
| Internal Core Voltage | 1.8 V (on-chip regulator) | — |
| I/O Bank Support | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) + 3.3 V PCI-compliant bank | — |
| Process Technology | 0.18-micron Flash-based CMOS | 0.18 µm |
| Configuration Memory | Non-volatile Flash (instant-on) | — |
| Programming Interface | JTAG IEEE 1149.1 (boundary-scan + ISP) | JTAG (IEEE 1149.1) / ISP |
| Kemasan | 256-ball FBGA (FineLine BGA), 17 x 17 mm | 256-ball FBGA (FineLine BGA) |
| Suhu Operasi | -40C to +100C (TJ), industrial | -40 °C to +100 °C (industrial, "I") |
| Speed Grade | I5 (industrial, 6.2 ns tPD) | 5 |
| Jenis Pemasangan | Surface Mount (SMT, BGA) | Surface Mount |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Boson Bebas | Compliant (per GlobalSpec) | — |
| Country of Origin | Malaysia / Republic of Korea | — |
| Device Family | — | MAX II |
| Macrocell Count | — | 980 |
| Pin/Package Count | — | 256 |
| Supply Voltage (VCCINT) | — | 1.8 V |
| I/O Supply Voltage (VCCIO) | — | 2.5 V / 3.3 V |
| Maximum Internal Frequency | — | 201.1 MHz |
| Pin-to-Pin Delay (tPD) | — | 6.2 ns |