EPM1270F256I5N vs EPM1270F256I5 Perbandingan
Perbandingan bersamaan detil EPM1270F256I5N dari Intel dan EPM1270F256I5 dari Altera. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EPM1270F256I5N | EPM1270F256I5 |
|---|---|---|
| Merek | Intel | Altera |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Series | MAX II | EPM1270 |
| Family | MAX II (EPM1270) | — |
| Device Type | CPLD - Complex Programmable Logic Device | — |
| Macro Cells | 980 | — |
| Logic Elements | 1270 | 1270 |
| User I/O Pins | 212 | 212 (max) |
| User Flash Memory | 8 Kbits | 8 Kbits |
| Maximum Operating Frequency | 201.1 MHz | — |
| Pin-to-Pin Logic Delay | 6.2 ns (I5 speed grade) | — |
| External Supply Voltage | 2.5 V / 3.3 V | — |
| Internal Core Voltage | 1.8 V (on-chip regulator) | — |
| I/O Bank Support | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) + 3.3 V PCI-compliant bank | — |
| Process Technology | 0.18-micron Flash-based CMOS | 0.18 µm |
| Configuration Memory | Non-volatile Flash (instant-on) | — |
| Programming Interface | JTAG IEEE 1149.1 (boundary-scan + ISP) | JTAG (IEEE 1149.1) / ISP |
| Paket | 256-ball FBGA (FineLine BGA), 17 x 17 mm | 256-ball FBGA (FineLine BGA) |
| Suhu Kerja | -40C to +100C (TJ), industrial | -40 °C to +100 °C (industrial, "I") |
| Speed Grade | I5 (industrial, 6.2 ns tPD) | 5 |
| Tipe Mounting | Surface Mount (SMT, BGA) | Surface Mount |
| Status RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Bebas Halogen | Compliant (per GlobalSpec) | — |
| Country of Origin | Malaysia / Republic of Korea | — |
| Device Family | — | MAX II |
| Macrocell Count | — | 980 |
| Pin/Package Count | — | 256 |
| Supply Voltage (VCCINT) | — | 1.8 V |
| I/O Supply Voltage (VCCIO) | — | 2.5 V / 3.3 V |
| Maximum Internal Frequency | — | 201.1 MHz |
| Pin-to-Pin Delay (tPD) | — | 6.2 ns |