EPM2210GF324C4N - 2210 LE MAX II CPLD 324-FBGA | Intel
MPN: EPM2210GF324C4N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $35.2 | $352.00 |
| 100 | $31.8 | $3,180.00 |
| 500 | $28.4 | $14,200.00 |
| 1,000 | $25.6 | $25,600.00 |
Drop-in alternatives for EPM2210GF324C4N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EPM2210F324C3N
✅ Drop-In✓ In Stock
$65.2 / Unit
View Datasheet →EPM2210F324C5N
✅ Drop-In📋 Reference alternative (not in catalog)
EPM2210F324I8N
✅ Drop-In✓ In Stock
$21.8 / Unit
View Datasheet →EPM2210F324I5N
✅ Drop-In📋 Reference alternative (not in catalog)
EPM1270F256C5N
✅ Drop-In✓ In Stock
$16.2 / Unit
View Datasheet →EPM2210GF324C4N Maximum Ratings & Electrical Characteristics
| Family | MAX II |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Logic Elements | 2,210 |
| Equivalent Macrocells | 1,700 |
| User I/Os (max) | 272 |
| User Flash Memory (UFM) | 8 Kbits |
| Supply Voltage - Core (VCCINT) | 1.8 V |
| MultiVolt I/O Support | 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V |
| Maximum Internal Frequency | 247.5 MHz |
| Pin-to-Pin Logic Delay (tPD) | 7.0 ns (C4 speed grade) |
| Process Technology | 0.18 µm 6-layer-metal flash |
| Package | 324-ball FineLine BGA (GF324) |
| Programming Interface | IEEE 1149.1 JTAG (ISP) |
| Operating Temperature (commercial) | 0 °C to +85 °C |
| RoHS Status | Compliant |
EPM2210GF324C4N 324-ball fineline bga (gf324) Pin Configuration Guide
Complete pinout information for EPM2210GF324C4N (324-ball fineline bga (gf324) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPM2210GF324C4N.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM2210GF324C4N is suitable for 6 applications: Bus Interface Bridging and Glue Logic, Power-Up and Power-Down Sequencing, Industrial Fieldbus Protocol Glue, Legacy 74-series Logic Replacement, I/O Expansion and Level Translation, State-Machine Control for Motor Drives.
Bus Interface Bridging and Glue Logic
The EPM2210GF324C4N is widely used as bus-bridging glue logic between processors, ASICs, and peripherals that speak mismatched protocols such as I2C-to-SPI, SPI-to-parallel, or CMOS-to-LVDS. Its 272 user I/Os and 1.8 V core with MultiVolt I/O support (1.5 V to 5.0 V) allow direct interfacing to 5 V TTL peripherals without external level shifters, simplifying the BOM. The 7 ns pin-to-pin logic delay at the C4 speed grade is fast enough for most asynchronous handshakes, and the flash-backed instant-on (<1 ms) avoids the boot-time stalls seen with SRAM FPGAs. Engineers typically fit the design in Quartus Prime and program via JTAG on the assembled board.
Recommended
Power-Up and Power-Down Sequencing
Deterministic sequencing of multiple power rails is a classic CPLD application, and the EPM2210GF324C4N's 272 I/Os make it suitable for sequencing 10 or more rails in telecom or server hardware. Its instant-on flash configuration starts executing logic within microseconds of VCCINT ramp, which is faster than any SRAM FPGA and avoids the boot-time glitches that can damage downstream regulators. The MultiVolt I/O banks let one CPLD drive enable pins of 1.5 V, 3.3 V, and 5.0 V regulators from a single part. Programmable watchdog timers and brown-out detection can be implemented in the UFM-backed logic array.
Recommended
Industrial Fieldbus Protocol Glue
In industrial automation, the EPM2210GF324C4N serves as glue logic between fieldbus transceivers (RS-485, RS-232, CAN) and a host processor running Modbus, PROFIBUS, or EtherCAT stacks. The 0.18 µm flash process and industrial-grade variants such as the EPM2210F324I5N tolerate -40 °C to +100 °C ambient conditions found in factory cabinets. Deterministic 7 ns tPD allows protocol bit-banging at standard baud rates without jitter, and the 8 Kbit UFM can store node addresses, calibration constants, or fault logs that must survive power cycles. JTAG ISP enables field firmware updates via the same UART used for diagnostics.
Recommended
Legacy 74-series Logic Replacement
Designers frequently consolidate dozens of 74HC, 74F, and 74LVTH packages into a single EPM2210GF324C4N, reducing PCB area and BOM count while gaining reconfigurability. With 2,210 logic elements and 272 I/Os, a single part can replace 20-40 discrete SSI/MSI packages in a typical glue-logic design. The flash-backed configuration retains the logic through power cycles, so replacement boards boot identically without re-flash steps. Industrial-grade drop-ins (EPM2210F324I5N, EPM2210F324I8N) cover the temperature ranges that legacy 74-series parts were specified for, easing the qualification of replacement designs.
Recommended
I/O Expansion and Level Translation
When a host microcontroller or SoC runs out of I/O pins, the EPM2210GF324C4N can be added as an I/O expander with up to 272 user I/Os, multiplexed through a parallel or SPI host interface. Its MultiVolt I/O banks (1.5 V, 1.8 V, 2.5 V, 3.3 V, 5.0 V) handle level translation between mismatched voltage domains, eliminating discrete translator ICs. The 247.5 MHz maximum internal frequency supports fast multiplexing and PWM generation, while the 7 ns tPD ensures deterministic response to host commands. JTAG ISP allows the I/O map to be updated in the field without depopulating the part.
Recommended
State-Machine Control for Motor Drives
The deterministic timing and instant-on behavior of the EPM2210GF324C4N make it a strong fit for state-machine controllers in stepper and BLDC motor drive boards. Its 2,210 logic elements are sufficient to encode complex commutation tables, fault-handling state machines, and encoder-decoding logic that would otherwise require a DSP or microcontroller. Industrial-grade variants (EPM2210F324I5N, EPM2210F324I8N) handle the -40 °C to +100 °C ambient typical of motor enclosures, and the MultiVolt I/O banks interface directly to 5 V gate drivers and 3.3 V Hall-effect sensors. The 8 Kbit UFM can store motor calibration tables that persist across power cycles.
Recommended
Recommended Products Summary
Engineering reference data for EPM2210GF324C4N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM2210F324C3N | EPM2210F324C5N | EPM2210F324I5N | EPM2210F324I8N |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Package | 324-ball FineLine BGA | 324-ball FineLine BGA - same | 324-ball FineLine BGA - same | 324-ball FineLine BGA - same | 324-ball FineLine BGA - same |
| Logic Elements | 2,210 | 2,210 | 2,210 | 2,210 | 2,210 |
| User I/Os (max) | 272 | 272 | 272 | 272 | 272 |
| Speed Grade | C4 (commercial) | C3 (slower) | C5 (faster) | I5 (industrial) | I8 (industrial) |
| Pin-to-Pin Delay (tPD) | 7.0 ns | ~9.0 ns | ~5.5 ns | ~6.5 ns | ~8.5 ns |
| Core Voltage (VCCINT) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Operating Temperature | 0 °C to +85 °C (commercial) | 0 °C to +85 °C | 0 °C to +85 °C | -40 °C to +100 °C | -40 °C to +100 °C |
| User Flash Memory (UFM) | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits |
Key Differentiators
- Largest density in the MAX II family (vs EPM1270F256C5N)
- Faster tPD than I-grade drop-ins (vs EPM2210F324I8N)
- Same footprint as full family of speed grades (vs EPM2210F324C3N)
Design Notes
Each I/O bank of the EPM2210GF324C4N has an independent VCCIO rail that can be powered at 1.5 V, 1.8 V, 2.5 V, 3.3 V, or 5.0 V. According to the MAX II handbook, all VCCIO rails must ramp to within specification before or coincident with VCCINT (1.8 V core) to prevent latch-up; a simple power-sequencer IC or RC delay on the core supply enforces this if the system rails come up in an uncontrolled order. Decouple each VCCIO bank with a 0.1 µF X7R ceramic placed within 5 mm of the package, and add a bulk 10 µF tantalum or ceramic near the FineLine BGA to handle simultaneous-switching-current spikes.
The 324-ball FineLine BGA has a junction-to-ambient thermal resistance (θJA) in the 15-20 °C/W range when mounted on a JEDEC JESD51 test board with adequate thermal vias. Estimated: at the typical MAX II quiescent current of a few milliamps plus I/O switching, the part dissipates well under 500 mW, so a 4-layer board with a small ground plane keeps the junction rise below 10 °C. For industrial enclosures with no airflow, fan-out the BGA balls to internal copper planes and stitch thermal vias under the die to spread heat. Derate above +70 °C ambient if the design drives many 5 V outputs at high toggle rates.
The FineLine BGA uses a 1.0 mm ball pitch, which is achievable on standard 4-layer FR-4 with 4 mil traces and 8 mil spaces; finer pitches require 6-layer stack-ups with microvia technology. Match the JTAG chain length and route TCK with a clean ground reference to avoid programming failures; place a 10 kΩ pull-up on TCK, TMS, and TDI as recommended in the MAX II handbook. Keep the JTAG header away from switching regulators or clock traces to prevent ISP errors in noisy environments. The dedicated JTAG pins cannot be repurposed as GPIO on the 324-ball package, so plan the I/O budget accordingly.
Do not confuse the EPM2210GF324C4N with the EPM2210F324C4 (without the 'N' suffix); the N indicates lead-free / Pb-free ball composition, which is mandatory for RoHS-compliant reflow profiles but is electrically identical. Avoid mixing C3, C4, and C5 speed grades in the same JTAG chain when multi-device programming, because the chain sees the slowest tPD across all parts. The User Flash Memory (UFM) block is read-only during user mode unless explicitly instantiated in the Quartus design - leaving it out frees logic resources but loses the 8 Kbit non-volatile storage capability.
Compliance Information
RoHS and REACH compliant per Intel product declaration. The 'N' suffix in EPM2210GF324C4N indicates lead-free (Pb-free) ball composition suitable for RoHS reflow profiles. AEC-Q100 automotive qualification is not applicable for this commercial-grade part; automotive designs should consider MAX V or Cyclone families that are AEC-Q100 qualified.
