EPM2210GF324C4N vs EPM2210GF324C5N Karşılaştırma
Ayrıntılı yan yana karşılaştırma EPM2210GF324C4N tarafından Intel ve EPM2210GF324C5N tarafından IntelAnahtar özellikleri, elektriksel parametreleri, ambalajı, yaşam döngüsü durumu, fiyatlandırma ve mevcudiyeti karşılaştırarak tasarım gereksinimleriniz için en iyi bileşeni belirleyin.
Özellik Karşılaştırması
| Parametre | EPM2210GF324C4N | EPM2210GF324C5N |
|---|---|---|
| Marka | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Yaşam Döngüsü Durumu | Aktif | Aktif |
| Family | MAX II | MAX II G |
| Device Type | CPLD (Complex Programmable Logic Device) | — |
| Logic Elements | 2,210 | 2210 |
| Equivalent Macrocells | 1,700 | 1700 |
| User I/Os (max) | 272 | — |
| User Flash Memory (UFM) | 8 Kbits | 8 Kbits |
| Supply Voltage - Core (VCCINT) | 1.8 V | — |
| MultiVolt I/O Support | 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V | — |
| Maximum Internal Frequency | 247.5 MHz | — |
| Pin-to-Pin Logic Delay (tPD) | 7.0 ns (C4 speed grade) | — |
| Process Technology | 0.18 µm 6-layer-metal flash | — |
| Paket | 324-ball FineLine BGA (GF324) | 324-ball FineLine BGA (FBGA-324), 19 x 19 mm, 1.0 mm pitch |
| Programming Interface | IEEE 1149.1 JTAG (ISP) | — |
| Operating Temperature (commercial) | 0 °C to +85 °C | — |
| RoHS Durumu | Compliant | Compliant |
| Series | — | MAX II |
| Maximum User I/O | — | 212 |
| Pin-to-Pin Delay (tPD) | — | 11.2 ns |
| Propagation Delay | — | 11.2 ns (max) |
| Technology | — | Flash CMOS, 6-layer metal |
| Core Voltage | — | 3.3 V / 2.5 V (internal) |
| I/O Standards | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V (MultiVolt) |
| İşletim Sıcaklığı | — | 0 °C to +85 °C (commercial) |
| Montaj Türü | — | Surface Mount |
| Programmability | — | In-system (JTAG / IEEE 1532), non-volatile |
| Lead Free | — | Yes |
| MSL Seviyesi | — | 3 |