EPM2210GF324C4N vs EPM2210GF324C5N Perbandingan
Perbandingan bersamaan detil EPM2210GF324C4N dari Intel dan EPM2210GF324C5N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EPM2210GF324C4N | EPM2210GF324C5N |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Family | MAX II | MAX II G |
| Device Type | CPLD (Complex Programmable Logic Device) | — |
| Logic Elements | 2,210 | 2210 |
| Equivalent Macrocells | 1,700 | 1700 |
| User I/Os (max) | 272 | — |
| User Flash Memory (UFM) | 8 Kbits | 8 Kbits |
| Supply Voltage - Core (VCCINT) | 1.8 V | — |
| MultiVolt I/O Support | 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V | — |
| Maximum Internal Frequency | 247.5 MHz | — |
| Pin-to-Pin Logic Delay (tPD) | 7.0 ns (C4 speed grade) | — |
| Process Technology | 0.18 µm 6-layer-metal flash | — |
| Paket | 324-ball FineLine BGA (GF324) | 324-ball FineLine BGA (FBGA-324), 19 x 19 mm, 1.0 mm pitch |
| Programming Interface | IEEE 1149.1 JTAG (ISP) | — |
| Operating Temperature (commercial) | 0 °C to +85 °C | — |
| Status RoHS | Compliant | Compliant |
| Series | — | MAX II |
| Maximum User I/O | — | 212 |
| Pin-to-Pin Delay (tPD) | — | 11.2 ns |
| Propagation Delay | — | 11.2 ns (max) |
| Technology | — | Flash CMOS, 6-layer metal |
| Core Voltage | — | 3.3 V / 2.5 V (internal) |
| I/O Standards | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V (MultiVolt) |
| Suhu Kerja | — | 0 °C to +85 °C (commercial) |
| Tipe Mounting | — | Surface Mount |
| Programmability | — | In-system (JTAG / IEEE 1532), non-volatile |
| Lead Free | — | Yes |
| Level MSL | — | 3 |