EPM570GF256C3N vs EPM570F256C3N Comparison

Detailed side-by-side comparison of EPM570GF256C3N by Altera and EPM570F256C3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Altera
EPM570GF256C3N EPM570GF256C3N - 570 LEs MAX II G CPLD | Intel / Altera

EPM570GF256C3N - 570 LEs MAX II G CPLD | Intel / Altera

EPM570GF256C3N βœ“ Active
Intel
EPM570F256C3N

EPM570F256C3N - MAX II CPLD, 570 LEs, 256-FBGA | Intel / Altera

EPM570F256C3N βœ“ Active

Specification Comparison

Parameter EPM570GF256C3N EPM570F256C3N
Brand Altera Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Stock Status In Stock In Stock
Unit Price (USD) $9.40 $13.75
Family MAX II G MAX II
Device Type CPLD (Complex Programmable Logic Device) β€”
Logic Elements (LEs) 570 570
User I/Os 76 β€”
User Flash Memory 8 Kbit β€”
Logic Family CMOS β€”
Supply Voltage VCCINT 3.3 V (core) β€”
I/O Bank Voltage 1.5 V / 1.8 V / 2.5 V / 3.3 V β€”
Package 256-ball FineLine BGA (GF256), 17 x 17 mm, 1.0 mm pitch 256-ball FBGA (FineLine BGA)
Mounting Type Surface Mount (BGA) Surface Mount
Operating Temperature -40C to +125C (industrial) β€”
Programming Interface JTAG (IEEE 1149.1) / in-system programmable JTAG (IEEE 1532 / IEEE 1149.1) + ISP
Configuration Memory On-chip Flash (non-volatile, instant-on) β€”
RoHS Status Lead Free / RoHS Compliant Compliant (per DigiKey listing)
Lead Free Yes β€”
Equivalent Macrocells β€” 440
User Flash Memory (UFM) β€” 8 Kbits
Maximum Operating Frequency β€” 304 MHz
Process Technology β€” 0.18 um, 6-layer-metal flash CMOS
Core Voltage β€” 2.5 V / 3.3 V
I/O Voltage Support (MultiVolt) β€” 1.5 V, 1.8 V, 2.5 V, 3.3 V
User I/O Count β€” [DATA_NEEDED: confirm exact user-IO count for F256 package]
Operating Temperature (C3 grade) β€” 0 C to +85 C (commercial)
MSL Level β€” [DATA_NEEDED: MSL level not stated in provided data]
Lead-Free β€” Yes (per suffix 'N' convention)
Typical Macroscopic Functions β€” Glue logic, bus bridging, I/O expansion, power sequencing

Datasheets & Resources

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