EPM570GF256C3N vs EPM570F256C3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPM570GF256C3N sa pamamagitan ng Altera at EPM570F256C3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EPM570GF256C3N | EPM570F256C3N |
|---|---|---|
| Brand | Altera | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | MAX II G | MAX II |
| Device Type | CPLD (Complex Programmable Logic Device) | — |
| Logic Elements (LEs) | 570 | 570 |
| User I/Os | 76 | — |
| User Flash Memory | 8 Kbit | — |
| Logic Family | CMOS | — |
| Supply Voltage VCCINT | 3.3 V (core) | — |
| I/O Bank Voltage | 1.5 V / 1.8 V / 2.5 V / 3.3 V | — |
| Packhaging | 256-ball FineLine BGA (GF256), 17 x 17 mm, 1.0 mm pitch | 256-ball FBGA (FineLine BGA) |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Temperature na Operasyon | -40C to +125C (industrial) | — |
| Programming Interface | JTAG (IEEE 1149.1) / in-system programmable | JTAG (IEEE 1532 / IEEE 1149.1) + ISP |
| Configuration Memory | On-chip Flash (non-volatile, instant-on) | — |
| Tindminan RoHS | Lead Free / RoHS Compliant | Compliant (per DigiKey listing) |
| Lead Free | Yes | — |
| Equivalent Macrocells | — | 440 |
| User Flash Memory (UFM) | — | 8 Kbits |
| Maximum Operating Frequency | — | 304 MHz |
| Process Technology | — | 0.18 um, 6-layer-metal flash CMOS |
| Core Voltage | — | 2.5 V / 3.3 V |
| I/O Voltage Support (MultiVolt) | — | 1.5 V, 1.8 V, 2.5 V, 3.3 V |
| User I/O Count | — | [DATA_NEEDED: confirm exact user-IO count for F256 package] |
| Operating Temperature (C3 grade) | — | 0 C to +85 C (commercial) |
| Level ng MSL | — | [DATA_NEEDED: MSL level not stated in provided data] |
| Lead-Free | — | Yes (per suffix 'N' convention) |
| Typical Macroscopic Functions | — | Glue logic, bus bridging, I/O expansion, power sequencing |