EPM570GF256C3N vs EPM570F256C3N Perbandingan

Perbandingan bersamaan detil EPM570GF256C3N dari Altera dan EPM570F256C3N dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.

Perbandingan Spesifikasi

Parameter Umum EPM570GF256C3N EPM570F256C3N
Merek Altera Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Aktif Aktif
Family MAX II G MAX II
Device Type CPLD (Complex Programmable Logic Device) —
Logic Elements (LEs) 570 570
User I/Os 76 —
User Flash Memory 8 Kbit —
Logic Family CMOS —
Supply Voltage VCCINT 3.3 V (core) —
I/O Bank Voltage 1.5 V / 1.8 V / 2.5 V / 3.3 V —
Paket 256-ball FineLine BGA (GF256), 17 x 17 mm, 1.0 mm pitch 256-ball FBGA (FineLine BGA)
Tipe Mounting Surface Mount (BGA) Surface Mount
Suhu Kerja -40C to +125C (industrial) —
Programming Interface JTAG (IEEE 1149.1) / in-system programmable JTAG (IEEE 1532 / IEEE 1149.1) + ISP
Configuration Memory On-chip Flash (non-volatile, instant-on) —
Status RoHS Lead Free / RoHS Compliant Compliant (per DigiKey listing)
Lead Free Yes —
Equivalent Macrocells — 440
User Flash Memory (UFM) — 8 Kbits
Maximum Operating Frequency — 304 MHz
Process Technology — 0.18 um, 6-layer-metal flash CMOS
Core Voltage — 2.5 V / 3.3 V
I/O Voltage Support (MultiVolt) — 1.5 V, 1.8 V, 2.5 V, 3.3 V
User I/O Count — [DATA_NEEDED: confirm exact user-IO count for F256 package]
Operating Temperature (C3 grade) — 0 C to +85 C (commercial)
Level MSL — [DATA_NEEDED: MSL level not stated in provided data]
Lead-Free — Yes (per suffix 'N' convention)
Typical Macroscopic Functions — Glue logic, bus bridging, I/O expansion, power sequencing

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